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IMXRT500EC Datasheet(PDF) 21 Page - NXP Semiconductors

Part # IMXRT500EC
Description  i.MX RT500 Low-Power Crossover Processor Data Sheet with Addendum
PDF  119 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

IMXRT500EC Datasheet(HTML) 21 Page - NXP Semiconductors

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Tamb = -20 °C to +70 °C, unless otherwise specified.
Table 8. Power consumption in active mode
Symbol
Parameter
Conditions
Min
Typ1, 2,
3
Max
Unit
Cortex M33 in Active mode, DSP no clock4
CoreMark code executed from SRAM partition 305
IDDVDDCORE VDDCORE supply
current
HCLK = 12 MHz
VDDCORE = 0.7 V
-
1.61
-
mA
HCLK = 24 MHz
VDDCORE = 0.7 V
-
2.51
-
mA
HCLK = 48 MHz
VDDCORE = 0.7 V
-
4.26
-
mA
HCLK = 96 MHz
VDDCORE = 0.8 V
-
9.28
-
mA
HCLK = 192 MHz
VDDCORE = 0.9 V
-
20.44
-
mA
HCLK = 192 MHz
VDDCORE = 1.0 V
-
23.73
-
mA
HCLK = 192 MHz
VDDCORE = 1.1 V
-
27.87
-
mA
1. Typical ratings are not guaranteed. Typical values listed are at room temperature (25 °C). VDD_AO1V8 = VDD1V8 =
VDDIO_0/1/2/3/4 = VDDA_ADC1V8 = 1.8 V. VDDA_BIAS = VREFP = 1.8 V. USB1_VDD3V3 = 3.3 V
2. Characterized through bench measurements using typical samples.
3. Compiler settings: IAR C/C++ Compiler for Arm ver 8.40. High Speed, No Size constraints. The optimization level is
Low, Balanced.
4. Based on the power API library from the SDK software package available on nxp.com
5. SRAM partition 30 represents the worst case partition.
Tamb = -20 °C to +70 °C, unless otherwise specified.
Table 9. Power consumption in active mode
Symbol
Parameter
Conditions
Notes
Min
Typ1, 2, 3
Max
Unit
FFT code executed from SRAM partition 30 and 314; Internal LDO disabled
DSP in Active mode, M33 in WFI5
IDDVDDCORE VDDCORE
supply current
HCLK = 10 MHz
VDDCORE = 0.7 V
6
-
1.80
-
mA
HCLK = 40 MHz
6
5.30
mA
Table continues on the next page...
Thermal specifications
20
i.MX RT500 Low-Power Crossover Processor, Rev. 0, 02/2021
NXP Semiconductors



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