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IMXRT500EC Datasheet(PDF) 60 Page - NXP Semiconductors

Part # IMXRT500EC
Description  i.MX RT500 Low-Power Crossover Processor Data Sheet with Addendum
PDF  119 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

IMXRT500EC Datasheet(HTML) 60 Page - NXP Semiconductors

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Table 44. MIPI-I3C specifications when communicating with legacy I2C devices (continued)
Symbol
Characteristic
400 kHz/Fast mode
1 MHz/ Fast+ mode
Unit
Min.
Max.
Min.
Max.
START
condition
tLOW
LOW period of the SCL clock
1300
—
500
—
ns
tHIGH
HIGH period of the SCL clock
600
—
260
—
ns
tSU_DAT
Data set-up time
100
—
50
—
ns
tHD_DAT
Data hold time for I2C bus devices
—
—
—
—
ns
tf
Fall time of SDA and SCL signals
20*(Vdd/5.5
v)
300
20*(Vdd/5.
5 v)
120
ns
tr
Rise time of SDA and SCL signals
20
300
—
120
ns
tSU_STO
Set-up time for STOP condition
600
—
260
—
ns
tBUF
Bus free time between STOP and START
condition
1.3
—
0.5
—
µs
tSP
Pulse width of spikes that must be suppressed
by the input filter
0
50
0
50
ns
Table 45. MIPI-I3C open drain mode specifications
Symbol
Characteristic
Min.
Max.
Unit
Notes
tLOW_OD
LOW period of the SCL clock
200
—
ns
tDIG_OD_L tLOW_OD + tfDA_OD (min)
—
ns
tHIGH
HIGH period of the SCL clock
—
41
ns
tfDA_OD
Fall time of SDA signal
tCF
12
ns
1
tSU_OD
Data set-up time during open drain mode
3
—
ns
tCAS
Clock after START (S) Condition
• ENTAS0
• ENTAS1
• ENTAS2
• ENTAS3
38.4 n
1 μ
100 μ
2 m
50 m
s
s
s
s
tCBP
Clock before STOP (P) condition
tCAS(min)/2
—
ns
tMMOverlap Current master to secondary master overlap time
during handoff
tDIG_OD_L
—
ns
tAVAL
Bus available condition
1
—
μs
tIDLE
Bus idle condition
1
—
ms
tMMLock
Time internal where new master not driving SDA low
tAVAL
—
μs
1. Cb = total capacitance of the one bus line in pF.
External memory interface
i.MX RT500 Low-Power Crossover Processor, Rev. 0, 02/2021
59
NXP Semiconductors



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