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IMXRT500EC Datasheet(PDF) 4 Page - NXP Semiconductors |
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IMXRT500EC Datasheet(HTML) 4 Page - NXP Semiconductors |
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4 / 119 page ![]() Graphics/Multimedia • 2D Vector Graphics Processing Unit, running at frequencies of up to 200 MHz. • LCD Display Interface supporting smart LCD displays and video mode. • MIPI DSI Interface with on-chip PHY supporting transfer rates up to 895.1 Mbps. • FlexIO can be configured to provide a parallel interface to an LCD I/O Peripherals • Up to 136 general purpose I/O (GPIO) pins with configurable pull-up/pull-down resistors. Ports can be written as words, half-words, bytes, or bits. • Mirrored, secure GPIO0. • Individual GPIO pins can be used as edge and level sensitive interrupt sources, each with its own interrupt vector. • All GPIO pins can contribute to one of two ganged (OR’d) interrupts from the GPIO_HS module. • A group of up to 7 GPIO pins (from Port0/1) can be selected for Boolean pattern matching which can generate interrupts and/or drive a “pattern-match” output. • Adjustable output driver slew rates. • JTAG boundary scan Security • Secure Isolation: Protection from software and remote attacks using Trustzone for armV8M. Hardware isolation of AES keys • Secure Boot: firmware in ROM providing immutable root of trust • Secure Storage: Physically Unclonable Function (PUF) based key store, On-the-fly-AES decryption (OTFAD) of off-chip flash for code storage • Secure Debug: Certificate based debug authentication mechanism • Secure Loader: Supports firmware update mechanism with authenticity (RSA signed) and confidentiality (AES-CTR encrypted) protection • Secure Identity: 128-bit Universal Unique Identifier (UUID), 256-bit Compound Device Identifier (CDI) per TCG DICE specification • Cryptographic Accelerators • Symmetric cryptography (AES) with 128/192/256-bit key strength and protection against Side-channel analysis (Differential Power Analysis and Template attacks) • Asymmetric cryptography acceleration using CASPER co-processor • NIST SP 800-90b compliant TRNG design with 512-bit output per call • Hash engine with SHA-256 and SHA1 May be run from the FRO, the crystal oscillator or the CLKIN pin. • a second, independent PLL output provides alternate high-frequency clock source for the DSP CPU if the required frequency is different from the main system clock. (Note: 2nd PFD output from Main System PLL) • two additional PLL outputs provide potential clock sources to various peripherals. • Audio PLL for the audio subsystem. Power Control • Main external power supply: 1.8V ± 5% • Vddcore supply (from PMIC or internal PMU): adjustable from 0.6 V to 1.1 V (including retention mode) • Analog supply: 1.71-3.6 V • Five VDDIO supplies (can be shared or independent): 1.71 - 3.6 V • USB Supply: 3.0-3.6 V • Reduced power modes: • Sleep mode: CPU clock shut down (each CPU independently) • Deep_sleep mode: User-selectable configuration via PDSLEEPCFG • Deep_powerdown mode: Internal power removed from entire chip except “always-on” domain • Each individual SRAM partition can be independently powered-off or put into a low- power retain mode • DSP Domain can be powered-off independently from the rest of the system. • Ability to operate the synchronous serial interfaces in sleep or deep-sleep as a slave or USART clocked by the 32 kHz RTC oscillator • Wake-up from low-power modes via interrupts from various peripherals including the RTC and the OS/Event timer • RBB/FBB to provide additional control over power/ performance trade-offs • Power-On Reset (POR). Operating characteristics • Temperature range (ambient): -20 °C to +70 °C • VDDCORE: 0.7 V - 1.155 V • VDDIO_0/1/2/4: 1.71 V - 1.89 V • VDDIO_3: 1.71 V - 3.6 V i.MX RT500 Low-Power Crossover Processor, Rev. 0, 02/2021 3 NXP Semiconductors |
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