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IMXRT500EC Datasheet(PDF) 4 Page - NXP Semiconductors

Part # IMXRT500EC
Description  i.MX RT500 Low-Power Crossover Processor Data Sheet with Addendum
PDF  119 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

IMXRT500EC Datasheet(HTML) 4 Page - NXP Semiconductors

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Graphics/Multimedia
• 2D Vector Graphics Processing Unit, running at
frequencies of up to 200 MHz.
• LCD Display Interface supporting smart LCD displays
and video mode.
• MIPI DSI Interface with on-chip PHY supporting
transfer rates up to 895.1 Mbps.
• FlexIO can be configured to provide a parallel interface
to an LCD
I/O Peripherals
• Up to 136 general purpose I/O (GPIO) pins with
configurable pull-up/pull-down resistors. Ports can be
written as words, half-words, bytes, or bits.
• Mirrored, secure GPIO0.
• Individual GPIO pins can be used as edge and level
sensitive interrupt sources, each with its own interrupt
vector.
• All GPIO pins can contribute to one of two ganged
(OR’d) interrupts from the GPIO_HS module.
• A group of up to 7 GPIO pins (from Port0/1) can be
selected for Boolean pattern matching which can
generate interrupts and/or drive a “pattern-match”
output.
• Adjustable output driver slew rates.
• JTAG boundary scan
Security
•
Secure Isolation: Protection from software and remote
attacks using Trustzone for armV8M. Hardware
isolation of AES keys
•
Secure Boot: firmware in ROM providing immutable
root of trust
•
Secure Storage: Physically Unclonable Function
(PUF) based key store, On-the-fly-AES decryption
(OTFAD) of off-chip flash for code storage
•
Secure Debug: Certificate based debug authentication
mechanism
•
Secure Loader: Supports firmware update mechanism
with authenticity (RSA signed) and confidentiality
(AES-CTR encrypted) protection
•
Secure Identity: 128-bit Universal Unique Identifier
(UUID), 256-bit Compound Device Identifier (CDI) per
TCG DICE specification
• Cryptographic Accelerators
• Symmetric cryptography (AES) with
128/192/256-bit key strength and protection
against Side-channel analysis (Differential Power
Analysis and Template attacks)
• Asymmetric cryptography acceleration using
CASPER co-processor
• NIST SP 800-90b compliant TRNG design with
512-bit output per call
• Hash engine with SHA-256 and SHA1
May be run from the FRO, the crystal
oscillator or the CLKIN pin.
• a second, independent PLL output provides
alternate high-frequency clock source for the
DSP CPU if the required frequency is different
from the main system clock. (Note: 2nd PFD
output from Main System PLL)
• two additional PLL outputs provide potential
clock sources to various peripherals.
• Audio PLL for the audio subsystem.
Power Control
• Main external power supply: 1.8V ± 5%
• Vddcore supply (from PMIC or internal PMU):
adjustable from 0.6 V to 1.1 V (including retention
mode)
• Analog supply: 1.71-3.6 V
• Five VDDIO supplies (can be shared or
independent): 1.71 - 3.6 V
• USB Supply: 3.0-3.6 V
• Reduced power modes:
• Sleep mode: CPU clock shut down (each CPU
independently)
• Deep_sleep mode: User-selectable
configuration via PDSLEEPCFG
• Deep_powerdown mode: Internal power
removed from entire chip except “always-on”
domain
• Each individual SRAM partition can be
independently powered-off or put into a low-
power retain mode
• DSP Domain can be powered-off
independently from the rest of the system.
• Ability to operate the synchronous serial
interfaces in sleep or deep-sleep as a slave or
USART clocked by the 32 kHz RTC oscillator
• Wake-up from low-power modes via interrupts
from various peripherals including the RTC
and the OS/Event timer
• RBB/FBB to provide additional control over power/
performance trade-offs
• Power-On Reset (POR).
Operating characteristics
• Temperature range (ambient): -20 °C to +70 °C
• VDDCORE: 0.7 V - 1.155 V
• VDDIO_0/1/2/4: 1.71 V - 1.89 V
• VDDIO_3: 1.71 V - 3.6 V
i.MX RT500 Low-Power Crossover Processor, Rev. 0, 02/2021
3
NXP Semiconductors



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