| Electronic Components Datasheet Search |
|
ADS5242IPAP Datasheet(PDF) 22 Page - Texas Instruments |
|
|
|
|||||||||||||||||||||||||||||
ADS5242IPAP Datasheet(HTML) 22 Page - Texas Instruments |
|
22 / 29 page ![]() www.ti.com REFERENCE CIRCUIT DESIGN CLOCKING REF T REF B I SET 0.1 µF 2.2 µF 2 Ω 2 Ω 2.2 µF 0.1 µF 56.2k Ω ADS5242 ADS5242 SBAS330C – OCTOBER 2004 – REVISED OCTOBER 2005 and REFB externally. In this mode, the internal reference buffer is tri-stated. Since the switching The digital beam-forming algorithm relies on gain current for the four ADCs come from the matching across all receiver channels. A typical externally-forced references, it is possible for the system would have about 24 quad ADCs on the performance to be slightly less than when the internal board. In such a case, it is critical to ensure that the references are used. It should be noted that in this gain is matched, essentially requiring the reference mode, VCM and ISET continue to be generated from voltages seen by all the ADCs to be the same. the internal bandgap voltage, as in the internal Matching references within the four channels of a reference mode. It is therefore important to ensure chip is done by using a single internal reference that the common-mode voltage of the voltage buffer. Trimming the reference voltages on externally-forced reference voltages matches to each chip during production ensures the reference within 50mV of VCM. The state of the reference voltages are well matched across different chips. voltages during various combinations of PD and INT/EXT is shown in Table 1. All bias currents required for the internal operation of the device are set using an external resistor to Table 1. State of Reference Voltages for Various ground at pin ISET. Using a 56.2kΩ resistor on ISET Combinations of PD and INT/EXT generates an internal reference current of 20 µA. This current is mirrored internally to generate the bias PD 0 0 1 1 current for the internal blocks. Using a larger external INT/EXT 0 1 0 1 resistor at ISET reduces the reference bias current and REFT Tri-State 1.95V Tri-State Tri-State thereby scales down the device operating power. REFB Tri-State 0.95V Tri-State Tri-State However, it is recommended that the external resistor be within 10% of the specified value of 56.2k Ω so VCM 1.45V 1.45V Tri-State(1) Tri-State(1) that the internal bias margins for the various blocks are proper. (1) Weak pull-down (approximately 5k Ω) to ground. Buffering the internal bandgap voltage also generates a voltage called VCM, which is set to the midlevel of REFT and REFB, and is accessible on a pin. It is The four channels on the chip operate from a single meant as a reference voltage to derive the input ADCLK input. To ensure that the aperture delay and common-mode in case the input is directly coupled. It jitter are same for all the channels, a clock tree can also be used to derive the reference network is used to generate individual sampling common-mode voltage in the external reference clocks to each channel. The clock paths for all the mode. channels are matched from the source point all the way to the sample-and-hold amplifier. This ensures When using the internal reference mode, a 2 Ω that the performance and timing for all the channels resistor should be added between the reference pins are identical. The use of the clock tree for matching (REFT and REFB) and the decoupling capacitor, as introduces an aperture delay, which is defined as the shown in Figure 37. If the device is used in the delay between the rising edge of ADCLK and the external reference mode, this 2 Ω resistor is not actual instant of sampling. The aperture delays for all required. the channels are matched to the best possible extent. However, a mismatch of ±20ps (±3σ) could exist between the aperture instants of the four ADCs within the same chip. However, the aperture delays of ADCs across two different chips can be several hundred picoseconds apart. Another critical specification is the aperture jitter that is defined as the uncertainty of the sampling instant. The gates in the clock path are designed to provide an rms jitter of approximately 1ps. Ideally, the input ADCLK should have a 50% duty cycle. However, while routing ADCLK to different components onboard, the duty cycle of the ADCLK reaching the ADS5242 could deviate from 50%. A smaller (or larger) duty cycle reduces the time Figure 37. Internal Reference Mode available for sample or hold phases of each circuit, and is therefore not optimal. For this reason, the The device also supports the use of external internal PLL is used to generate an internal clock that reference voltages. This mode involves forcing REFT has 50% duty cycle. The input sampling instant, 22 |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |