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SC18IM704 Datasheet(PDF) 18 Page - NXP Semiconductors |
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SC18IM704 Datasheet(HTML) 18 Page - NXP Semiconductors |
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18 / 28 page ![]() NXP Semiconductors SC18IM704 UART to I2C-bus bridge 14 PCB layout DIMENSIONS in mm Ay By D1 D2 Gy Hy P1 C Gx sot403-1_fr Hx SOT403-1 solder land occupied area Footprint information for reflow soldering of TSSOP16 package Ay By Gy C Hy Hx Gx P1 Generic footprint pattern Refer to the package outline drawing for actual layout P2 (0.125) (0.125) D1 D2 (4x) P2 7.200 4.500 1.350 0.400 0.600 5.600 5.300 7.450 5.800 0.650 0.750 Figure 19. SOT403-1 (TSSOP16) footprint information for reflow soldering SC18IM704 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved. Product data sheet Rev. 1.0 — 22 September 2021 18 / 28 |
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