ISO7041 datasheet(6/34 Pages) TI

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6.4 Thermal Information

THERMAL METRIC(1)

ISO7041-Q1

UNIT

DBQ (SOIC)

16 PINS

RθJA

Junction-to-ambient thermal resistance

87.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

33.3

°C/W

RθJB

Junction-to-board thermal resistance

49.1

°C/W

ψJT

Junction-to-top characterization parameter

8.4

°C/W

ψJB

Junction-to-board characterization parameter

48.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15

pF, Input a 1-MHz 50% duty cycle square

wave

7.82

PD1

Maximum power dissipation (side-1)

4.46

PD2

Maximum power dissipation (side-2)

3.36

ISO7041-Q1

SLLSFN3 – JUNE 2022

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