ISO7041 datasheet(8/34 Pages) TI

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6.6 Safety-Related Certifications

VDE

CSA

CQC

TUV

Certified according to DIN

VDE V 0884-11:2017- 01

Certified according to IEC

60950-1 and IEC 62368-1

Certified according to

UL 1577 Component

Recognition Program

Certified according to

GB4943.1-2011

Certified according

to EN 61010-1:2010/

A1:2019, EN 60950-

1:2006/A2:2013 and EN

62368-1:2014

Maximum transient

isolation voltage,

4242 VPK;

Maximum repetitive peak

isolation voltage, 566 VPK;

Maximum surge isolation

voltage,

4000 VPK

3000 VRMS insulation per

CSA 60950-1-07+A1+A2,

IEC 60950-1 2nd

Ed.+A1+A2, CSA

62368-1- 14 and IEC

62368-1:2014 370 VRMS

(DBQ-16) maximum

working voltage (pollution

degree 2, material group I)

Single protection,

3000 VRMS

Basic insulation, Altitude ≤

5000 m, Tropical Climate,

400 VRMS maximum

working voltage

EN 61010- 1:2010/

A1:2019, 300 VRMS basic

isolation

EN 60950- 1:2006/

A2:2013 and EN

62368-1:2014, 400 VRMS

basic isolation

Certification Planned

6.7 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

16-QSOP PACKAGE

Safety input, output, or supply current

RθJA = 87°C/W, VI = 5.5 V, TJ = 150°C, TA

= 25°C

261

RθJA = 87°C/W, VI = 3.6 V, TJ = 150°C, TA

= 25°C

399

Safety input, output, or total power

RθJA = 87°C/W, TJ = 150°C, TA = 25°C

1435

Maximum safety temperature

150

°C

(1)

The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The

IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be

exceeded. These limits vary with the ambient temperature, TA.

The junction-to-air thermal resistance, RθJA, in the table is that of a device installed on a high-K test board for leaded surface-mount

packages. Use these equations to calculate the value for each parameter:

TJ = TA + RθJA × P, where P is the power dissipated in the device.

TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.

PS = IS × VI, where VI is the maximum input voltage.

ISO7041-Q1

SLLSFN3 – JUNE 2022

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