LCS7260C datasheet(3/35 Pages) POWERINT

3 / 35 page

Rev. D 11/22

HiperLCS-2

www.power.com

Pin Functional Description – Primary-Side Device

LCS726xC

Low-Side

PRIMARY GROUND (GD) (Pin 1)

Primary gate-drive ground. Should be capacitively decoupled to

primary supply pin (BPL).

BURST MODE (BM) (Pin 2)

Small signal output indicating deep burst mode operation. Can be

coupled to control external primary-side circuits.

PRIMARY GROUND (GP) (Pin 3)

Small signal primary ground. Should be capacitively decoupled to

primary 5 V (5VL) pin.

NO CONNECTION (NC) (Pin 4)

Pin not connected. Leave open.

BYPASS LOW-SIDE (BPL) (Pin 5)

Power supply pin for primary low-side device. Should be capacitively

decoupled to primary gate-drive ground (GD) pin.

PRIMARY LOW-SIDE 5 V (5VL) (Pin 6)

Primary low-side small signal 5 V IC-supply pin. Also provides bias

power to the Primary-side of the Isolation device (LSR2000). 5VL

should be capacitively decoupled to primary small signal ground (GP).

FLUXLINK INPUT (FL) (Pin 7)

Small signal input for FLUX LINK signal.

PROGRAM PRIMARY (PP) (Pin 8)

Small signal connection for customer configuration selection

components. Also used in some configurations as small signal

current input to receive power-good (remote on/off), signal to

command device activation. Likewise used in some configurations as

small signal current input for external fault. This pin also outputs

logic level error code during fault conditions.

NO CONNECT (NC) (Pin 9)

Pin not connected. Leave open.

PRIMARY GROUND (GP) (Pin 10)

Small signal primary ground. Should be capacitively decoupled to

primary 5 V (5VL) pin.

NO CONNECT (NC) (Pin 11)

Pin not connected. Leave open.

LINE SENSE (L) (Pin 12)

High-voltage small signal current input pin. Used to detect line-input

voltage. Also used in some configurations as small signal input to

receive power-good (remote on/off) signal to command device

activation.

S 24

1 GD

2 BM

3 GP

4 NC

HB 16-19

NC 13

5VH 14

BPH 15

5 BPL

6 5VL

7 FL

8 PP

9 NC

10 GP

11 NC

12 L

PI-8894-020321

High-Side

NO CONNECT (NC) (Pin 13)

Pin not connected. Leave open.

HIGH-SIDE 5 V (5VH) (Pin 14)

Primary high-side small signal 5 V IC-supply pin. Should be capacitively

decoupled to half-bridge (HB). NOTE: this pin floats on the half-

bridge switching voltage, can be at high-voltage with respect to

primary grounds.

BYPASS HIGH-SIDE (BPH) (Pin 15)

Power supply for primary high-side device. Should be capacitively

decoupled to half-bridge (HB) pin. NOTE: this pin floats on the

half-bridge switching voltage, can be at high-voltage with respect to

primary grounds.

HALF-BRIDGE (HB) (Pins 16-19 and Back Side HB Pad)

High-voltage and high current connection point for low-side MOSFET

DRAIN and high-side MOSFET SOURCE. The half-bridge node

typically switches between primary ground and primary input bus (HD).

SOURCE (S) (Pin 24)

High current Power ground return for half-bridge switch

current. Also, at same potential as other small-signal

primary grounds.

HD (Pin Back-Side Solder Pad)

High current, high-side MOSFET Drain and connection to system

high-voltage input bus.

Figure 6. HiperLCS2 Primary-Side LCS726XC, InSOP-24C (Bottom View.)

Figure 7. Primary-Side Packages.

InSOP-24C Top View, InSOP-24C Bottom View.

LCS7260C Datasheet(PDF) 3 Page - Power Integrations, Inc.

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