| Electronic Components Datasheet Search |
|
LPC55S2X Datasheet(PDF) 111 Page - NXP Semiconductors |
|
|
|||||||||||||||||||||||||||||
LPC55S2X Datasheet(HTML) 111 Page - NXP Semiconductors |
|
111 / 140 page ![]() LPC55S2x/LPC552x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2022. All rights reserved. Product data sheet Rev. 2.2 — 8 December 2022 111 of 139 NXP Semiconductors LPC55S2x/LPC552x 32-bit ARM Cortex-M33 microcontroller 13.4 RTC oscillator The crystal oscillator has embedded capacitor bank where it can be used as an integrated load capacitor for the crystal oscillators. The capacitor banks on each crystal pin can tune the frequency for crystals with a Capacitive Load (CL) between 6 to 10pF (IEC equivalent). Simple APIs to configure the Capacitor Banks based on the crystal Capacitive Load (CL) and measured PCB parasitic capacitances on XIN and XOUT pins. In the crystal oscillator circuit, only the crystal (XTAL) needs to be connected with the option to connect capacitances CX1 and CX2 on XTAL32K_P and XTAL32K_N pins. Depending upon the computation of the required Capacitance Load, there is no need to add some capacitance on PCB if computation is less than 20 pF (10 pF equivalent IEC), and if computation is greater than 20 pF (10 pF equivalent IEC), then additional capacitance is on PCB required. See Figure 22 and refer to the ”Cap Bank API” chapter in the user manual. In bypass mode, an external clock (maximum frequency of up to 100 kHz) can also be connected to XTAL32K_P if XTAL32K_N is left open. External [0 – VH] square signal can be applied on the XTAL32K_P pin with 1.1 V +/-10% A external signal below 1.0 V or above 1.2 V cannot be applied For best results, it is very critical to select a matching crystal for the on-chip oscillator. Load capacitance (CL), series resistance (RS), and drive level (DL) are important parameters to consider while choosing the crystal. 13.4.1 RTC Printed Circuit Board (PCB) design guidelines • Connect the crystal and external load capacitors on the PCB as close as possible to the oscillator input and output pins of the chip. • The length of traces in the oscillation circuit should be as short as possible and must not cross other signal lines. • Ensure that the load capacitors have a common ground plane. Fig 28. RTC oscillator components aaa-0181472-x LPC XTAL32K_P XTAL32K_N CX2 CX1 XTAL = CL CP RS L |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |