S29PL-J55BAI011 datasheet(19/96 Pages) SPANSION

19 / 96 page

September 22, 2006 S29PL-J_00_A9

S29PL-J

Da ta

Sh e e t

(Adv a n ce

In f o r m ation)

7.5

56-Pin TSOP 20 x 14 mm

Figure 7.4 56-Pin TSOP 20 x 14 mm Configuration—PL127J

For this family of products, a single multi-chip compatible package (TSOP) is offered for each density to allow

both standalone and multi-chip qualification using a single, adaptable package. This new methodology allows

package standardization resulting in faster development. The multi-chip compatible package includes all the

pins required for standalone device operation and verification. In addition, extra pins are included for insertion

of common data storage or logic devices to be used for multi-chip products. If a standalone device is required,

the extra multi-chip specific pins are not connected and the standalone device operates normally. The multi-

chip compatible package sizes were chosen to serve the largest number of combinations possible. There are

only a few cases where a larger package size would be required to accommodate the multi-chip combination.

This multi-chip compatible package set does not allow for direct package migration from the Am29BDS128H,

Am29BDS128G, Am29BDS640G products, which use legacy standalone packages.

RESET#

RY/BY#

VCC

DQ0

DQ1

DQ2

DQ3

VSSQ

DQ4

DQ5

DQ6

DQ7

VSS

WP#/ACC

WE#

A22

A21

A20

OE#

CE#

VSS

DQ15

DQ14

DQ13

DQ12

VSSQ

VCCQ

DQ11

DQ10

DQ9

DQ8

VCC

A19

A10

A11

A12

A18

A17

A16

A15

A14

A13

VCCQ

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