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MP5981 Datasheet(PDF) 5 Page - Monolithic Power Systems |
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MP5981 Datasheet(HTML) 5 Page - Monolithic Power Systems |
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5 / 27 page ![]() MP5981 – 16V, 50A, 1.1mΩ RDS(ON), HOT-SWAP INTELLI-FUSE SOLUTION MP5981 Rev. 1.3 MonolithicPower.com 5 5/16/2022 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2022 MPS. All Rights Reserved. PIN FUNCTIONS Pin # Name Description 9-16 VIN System input power supply. The MP5981 operates from a 4V to 16V input rail. 1, 2, 25-32 VOUT Output voltage controlled by the IC. VOUT is connected to the source of the integrated MOSFET. 3 D_OC Digital output of the over-current indication. D_OC is an open-drain output. When the CS voltage (VCS) is higher than 85% of CLREF, the D_OC logic is pulled low. 4 ON/PD Power FET on/off control and VOUT pull-down mode control. Drive ON/PD between 1.4V and 3V to turn the power FET on; drive ON/PD low to turn the power FET off. Do not float ON/PD. To pull down VOUT after a 2.1ms delay, use an integrated 500Ω resistor to force ON/PD to about 1V. If the MP5981 is controlled by the hot-swap controller, connect a 10k Ω resistor from ON/PD to GND. 5 GOK Intelli-Fuse fault reporting output. GOK asserts low and latches after a fault occurs. The faults that can trigger GOK include over-current fault (during normal operation), short- circuit fault, over-temperature fault, and FET health fault. GOK is an open-drain output pin. 6, 7 NC No connection. 8 MODE Latch or hiccup operation. If the mode pin is pulled to GND, the MP5981 operates in hiccup mode and automatically retries after ~560ms. The MODE pin has an internal pull up, and if not pulled low externally will default to latch mode operation. 17 NC No connection. Connect this pin to GND. 18 VTEMP Junction temperature sense output. 19 SS Soft-start set. An external capacitor connected to SS sets the soft-start time of the output voltage. The internal circuit controls the slew rate of the output voltage during turn-on. 20 GND Signal ground. 21 VDD3 Internal 3.0V LDO output. VDD3 can be driven with an external 3.3V to reduce loss from VIN. Place a 1µF decoupling capacitor close to VDD3 and GND. 22 IMON Current monitor output. The output current is proportional to the current flowing through the power device. 23 CS Current-sense output. CS requires an external resistor. The CS voltage (VCS) is compared with CLREF to determine the current limit. 24 CLREF Current-limit reference voltage input. ABSOLUTE MAXIMUM RATINGS (1) VIN (DC) .......................................-0.3V to +20V VIN (1 μs).................................................... +24V VIN (25ns).................................................. +29V VOUT ............................................-0.3V to +20V All other pins ................................-0.3V to +4.2V Continuous power dissipation (TA = 25°C) (2) ................................................................. 5.34W Junction temperature ................................150°C Lead temperature .....................................260°C Storage temperature ................ -65°C to +155°C Recommended Operating Conditions (3) Input voltage operating range ............. 4V to 16V Operating junction temp (TJ) .... -40°C to +125°C Thermal Resistance (4) θJA θJC LGA-32 (5mmx5mm) ............ 23.4 ....12.5 . °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θ JA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX) - TA) / θJA. Exceeding the maximum allowable power dissipation produces an excessive die temperature, causing the regulator to go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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