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RT5510WSC Datasheet(PDF) 32 Page - Richtek Technology Corporation

Part # RT5510WSC
Description  Audio Amplifier with IV Sense
PDF  52 Pages
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Manufacturer  RICHTEK [Richtek Technology Corporation]
Direct Link  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RT5510WSC Datasheet(HTML) 32 Page - Richtek Technology Corporation

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RT5510
Copyright © 2019 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation
www.richtek.com
DS5510-00
October
2019
32
The maximum power dissipation depends on the operating ambient temperature for the fixed TJ(MAX) and the
thermal resistance,
JA. The derating curves in Figure 27 allows the designer to see the effect of rising ambient
temperature on the maximum power dissipation.
Figure 27. Derating Curve of Maximum Power Dissipation
Layout Considerations
For the best performance of the RT5510, the below PCB layout guidelines including the below items must be strictly
followed.
VBAT connect to LX through the boost inductor. Place the inductor as close as possible to the chip with 80 mil
width at least. The shorter and wider trace provides lower parasitic inductance and resistance for achieving
better efficiency. The VBAT pin only consumes few micro amperes for internal analog circuit, so the trace with 6
mil width is enough for VBAT of the RT5510. The VBAT capacitor handling high noisy current for boost circuit,
please connect it to BGND and PGND first for shorten the current path and minimize the influence to digital
circuit.
LBST
Boost
Inductor
25*20mm
r
Main Ground
BGND & PGND
CINB
10µF/10V
0805
TOP
2nd Layer
GND
3rd Layer
Main Ground
Bottom
VBAT
VBAT
BCK
LRCK
DATAO
WDT/
ADS2
LX
LX
BGND
DATAI
SCL
DGND
RSTN
SDA
VSNSN
VSNSP
AGND
VREF
ADS1
PGND
PGND
OUTP
VBST
OUTN
PVDD
PVDD
VBST
A
B
C
D
E
F
BGND
VBAT
IOVDD
DVDD
BGND & PGND
INT
CVBAT
0.1µF/10V
0402
CPVDD
PVDD Cap
22µF/25V
0805
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
25
50
75
100
125
Ambient Temperature (°C)
Four-Layer PCB



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