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WM8593 Datasheet(PDF) 7 Page - Wolfson Microelectronics plc

Part # WM8593
Description  24-bit 192kHz 2Vrms Multi-Channel CODEC
PDF  98 Pages
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Manufacturer  WOLFSON [Wolfson Microelectronics plc]
Direct Link  http://www.wolfsonmicro.com
Logo WOLFSON - Wolfson Microelectronics plc

WM8593 Datasheet(HTML) 7 Page - Wolfson Microelectronics plc

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WM8593
w
PP Rev 1.0 January 2007
7
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at
or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical
Characteristics at the test conditions specified.
ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible
to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage
of this device.
Wolfson tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage
conditions prior to surface mount assembly. These levels are:
MSL1 = unlimited floor life at <30
°C / 85% Relative Humidity. Not normally stored in moisture barrier bag.
MSL2 = out of bag storage for 1 year at <30
°C / 60% Relative Humidity. Supplied in moisture barrier bag.
MSL3 = out of bag storage for 168 hours at <30
°C / 60% Relative Humidity. Supplied in moisture barrier bag.
The Moisture Sensitivity Level for each package type is specified in Ordering Information.
CONDITION
MIN
MAX
Digital supply voltage, DVDD
-0.3V
+4.5V
Analogue supply voltage, AVDD1
-0.3V
+7V
Analogue supply voltage, AVDD2
-0.3V
+15V
Voltage range digital inputs
DGND -0.3V
DVDD + 0.3V
Voltage range analogue inputs
TBD
AVDD1 + 2.4V
Master Clock Frequency
38.462MHz
Ambient temperature (supplies applied)
-55
°C
+125
°C
Storage temperature
-65
°C
+150
°C
Pb free package body temperature (reflow 10 seconds)
+260
°C
Package body temperature (soldering 2 minutes)
+183
°C
Note:
1.
Analogue and digital grounds must always be within 0.3V of each other.
THERMAL PERFORMANCE
PARAMETER
SYMBOL
TEST
CONDITIONS
MIN
TYP
MAX
UNIT
Thermal resistance – junction to
ambient
RθJA
TBD
See note 1
°C/W
Notes:
1.
Figure given for package mounted on 4-layer FR4 according to JESD51-7. (No forced air flow is assumed).
2.
Thermal performance figures are estimated.



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