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LT8640 Datasheet(PDF) 6 Page - Analog Devices

Part # LT8640
Description  42V, 10A/12A Peak Synchronous Step-Down Silent Switcher
PDF  35 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

LT8640 Datasheet(HTML) 6 Page - Analog Devices

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Data Sheet
LT8638-2
analog.com
Rev.0
6 of 35
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 3. Pin Configuration
Table 3. Pin Descriptions
PIN
NAME
DESCRIPTION
Pin 1
PHMODE
Pin determines the phase relationship between the LT8638-2’s internal clock and
CLKOUT. Tie it to GND for 2-phase operation, float the pin for 3-phase operation, or tie
it to INTVCCfor 4-phase operation. See BLOCK DIAGRAM for internal pull-up and pull-
down resistance.
Pin 2
BIAS
The internal regulator draws current from BIAS instead of VIN when BIAS is tied to a
voltage higher than 3.1V. For output voltages of 3.3V to 25V, this pin should be tied to
VOUT. If this pin is tied to a supply other than VOUT, use a 1µF local bypass capacitor on
this pin. If no supply is available, tie to GND. However, especially for high input or high
frequency applications, BIAS should be tied to output or an external supply of 3.3V or
above.
Pin 3
INTVCC
Internal 3.4V Regulator Bypass Pin. The internal power drivers and control circuits are
powered from this voltage. Do not load the INTVCC pin with external circuitry. INTVCC
current is supplied from BIAS if BIAS > 3.1V, otherwise current is drawn from VIN.
Voltage on INTVCC varies between 2.8V and 3.4V when BIAS is between 3.0V and 3.6V.
Place a low ESR ceramic capacitor of at least 1µF from this pin to ground close to the
IC.
24
25
26
27
28
23
9
10
11
12
13
14
LT8638-2
TOP VIEW
(Not to Scale)
PHMODE
BIAS
INTVCC
BST
SW
SW
SW
SW
RT
EN/UV
GND
NC
VIN
VIN
VIN
VIN
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
31
GND
29
GND
32
GND
30
GND
LQFN PACKAGE
28-LEAD (5mm × 4mm × 0.94mm)
JEDEC BOARD:
θJA = 30°C/W, θJC(TOP) = 14.7°C/W, θJC(PAD) = 2.7°C/W (NOTE 4)
DEMO BOARD:
θJA = 19°C/W, ΨJT = 0.1°C/W
EXPOSED PADS (PINS 29 TO 32) ARE GND, MUST BE SOLDERED TO PCB FOR
OPTIMAL THERMAL PERFORMANCE.



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