33797 datasheet(8/34 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

33797

ELECTRICAL CHARACTERISTICS

STATIC ELECTRICAL CHARACTERISTICS

VFIRE1A / VFIRE2A Current During High Side Safing Sensor Diagnostics

(Command $CO)

Per VFIREXA pin, with High Side Safing Sensor Diagnostic active

IRRE

260

350

400

µA

VFIRE1B / VFIRE2B Current During High Side Safing Sensor Diagnostics

(Command $CO)

Per VFIREXB pin, with High Side Safing Sensor Diagnostic active

IRRE

µA

VFIRE1B / VFIRE2B Current During VFIRE Diagnostics (Command $C5)

Either VFIRE!B or VFIRE2B Diagnostic active

IRRE

0.3

2.0

3.8

VFIRE Quiescent Current - Total

All VFIRE pins measured together, with Diagnostics Off

IQVFIRETOTAL

135

180

µA

Maximum Allowable External Capacitance to Ground (9)

Per Squib pin SQB_LO and SQB_HI

CSMAX

–

0.12

µF

Maximum Allowable External Resistance to Ground During Firing (9)

VFIRE_RTN pin to Ground

RSMAX

–

0.15

Ω

Individual FET Driver Thermal Shutdown (9), (10)

TSD

160

–

190

FET Driver Thermal Shutdown Re-Enable Threshold After Drive Cool-down

(9), (10)

TREN

–

110

FET DRIVERS HIGH- AND LOW-SIDE DRIVER TRANSISTOR STATUS/DIAGNOSTICS ($82, $83 COMMANDS)

Voltage Transistor Test Threshold for High-Side Driver Transistor

VTRANTST1

5.5

6.0

6.5

High-Side Driver Current Limit During High-Side Driver Transistor

Diagnostics

15 V

≤ V

VFIRE_XX ≤ 35 V

ITRANTST1

2.0

Voltage Transistor Test Threshold for Low-Side Driver Transistor

VTRANTST2

1.0

1.4

2.0

Low-Side Driver Current Limit During Low-Side Driver Transistor

Diagnostics

15 V

≤ V

VFIRE_XX ≤ 35 V

ITRANTST2

2.0

FEN INPUT PIN (FEN_1 AND FEN_2)

Internal Current Pull-Down

IFEN

-25

-40

-50

µA

Logic Low Level

VFEN(LO)

0.0

2.5

0.35 x VDD

Fire Enable Pin Logic High Level

VFEN(HI)

0.65 x VDD

2.5

1.0 x VDD

Notes

Guaranteed by design.

With a nominal squib load, the FET squib driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms.

The individual squib driver thermal shutdown will not affect other squib driver firing ON times. With a shorted squib load, the FET squib

driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms. When the thermal shutdown limit is

exceeded, the FET driver will turn OFF and the thermal status bit will be set to 1. The FET squib driver can be activated through the

arm/fire command when the TEMPRENABLE (MIN) is reached (thermal shutdown status “0”). Nominal squib load: 2.15 Ω ±0.15 Ω.

Shorted squib load: 0.1

Ω.

Table 3. Static Electrical Characteristics (continued)

Characteristics noted under conditions 4.75 V ≤ VDD ≤ 5.25 V; 7.0 V ≤ VVFIRE_XX ≤ 35 V; VVDIAG_X = VVFIRE_XX; FEN 1 = FEN 2

= VDD; RR_LIMIT_X = 10 kΩ ±1%, RR_DIAG = 10 kΩ ±1%, -40°C ≤ TA ≤ +85°C, GND = 0 unless otherwise noted. Typical values

noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.

Characteristic

Symbol

Min

Typ

Max

Unit

33797 Datasheet(PDF) 8 Page - Freescale Semiconductor, Inc

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