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LTC2686 Datasheet(PDF) 11 Page - Analog Devices

Part # LTC2686
Description  8-Channel, 12-/16-Bit Voltage Output SoftSpan DAC
PDF  45 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

LTC2686 Datasheet(HTML) 11 Page - Analog Devices

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Data Sheet
LTC2686
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
analog.com
Rev. A | 11 of 45
Table 7. Pin Function Descriptions—WLCSP (Continued)
Pin No.
Mnemonic
Description
A3
REFCOMP
Internal Reference Compensation. For low noise and reference stability, tie REFCOMP to a 0.1 μF capacitor to
GND. Tying REFCOMP to GND causes the device to power up with the internal reference disabled, allowing the
use of an external reference at start up.
A4, B4, G6, H5, H6
REFL
Reference Low Pins. Signal ground for all DAC channels and internal reference. Tie the REFL pins to a clean
analog ground plane.
A5, B5
VCC
Analog Supply Voltage Input. 4.75 V ≤ VCC ≤ 5.25 V. Bypass VCC to GND with a 1 μF capacitor.
A6, C2, C3, C4, C5, C6,
C7, D3, D4, D5, D6, E3, E4,
E5, E6, F3, F4, F5, F6
GND
Analog Ground. Tie GND to a clean analog ground plane.
F2, A7, B7
TGP0, TGP1, TGP2
Asynchronous Toggle and Sinusoidal Dither Multifunctional Pins. In toggle mode, a falling edge updates the DAC
register with data from Input Register A and a rising edge updates the DAC register with data from Input Register
B. In sinusoidal dither mode, the toggle pins function as dither clock inputs. DAC outputs update on the rising
edge. Toggle and dither operations only affect those DAC channels with their toggle/dither enable bit (ENx) set to
1. When neither toggle nor dither operations are used,tie the TGPx pins to GND, and set EN to 0. Logic levels are
determined by IOVCC.
A8
NC
Not Internally Connected.
C8, D7, E7, G8, E2, E1, D2,
B1
COMP0 to COMP7
Compensation Pins for DAC Output Drivers. When driving high capacitive loads, connect a capacitor between
VOUTx and its respective COMPx pin.
B8, D8, E8, F8, G1, F1, D1,
C1
VOUT0 to VOUT7
DAC Analog Voltage Outputs.
B3
REF
Reference Input/Output. The voltage at the REF pin sets the full-scale range of all channels. By default, the internal
reference is routed to this pin. The REF pin must be buffered when driving external dc load currents. When set to
external reference mode, the internal reference is disconnected, and the REF pin becomes a high impedance input
to which a precision external reference can be applied. For low noise and reference stability, tie a capacitor from the
REF pin to GND. The value must be less than the capacitance at the REFCOMP pin. In external reference mode,
the allowable reference input voltage range is 2.0 V to VCC − 0.6 V.
B6
FAULT
Fault Indicator. FAULT is an open-drain, N channel output that pulls low when a fault condition occurs. A fault
condition is detected when the junction temperature exceeds 160°C or when an SPI transaction error occurs. The
FAULT pin is released on the next CS/LD rising edge. A pull-up resistor of ≥10 kΩ is recommended.
F7
MUXOUT
Analog Multiplexer Output. Any of the 16 DAC output pin voltages, current load sense voltages (VSENSE), and
junction temperatures can be monitored by measuring the voltage at the MUX pin. When the mux is disabled, the
MUX pin becomes high impedance. A full listing of available mux functions is given in Table 23.
G7, H8
V1+
Analog Positive Supply for the VOUT0 to VOUT7 DAC Outputs. Bypass V1+ to GND with a 1 μF capacitor. V1+
must be greater than or equal to V2+.
G2, H1
IOVCC
Digital Input/Output Supply Voltage. 1.71 V ≤ IOVCC ≤ VCC + 0.3 V. Bypass IOVCC to GND with a 0.1 μF
capacitor.
G3
SDI
Serial Interface Data Input. Data on SDI is clocked into the DAC on the rising edge of SCK. The LTC2686 accepts
input word lengths of 24 bits or 32 bits. Logic levels are determined by IOVCC.
G4
SCK
Serial Interface Clock Input. Logic levels are determined by IOVCC.
H3
SDO
Serial Interface Data Output. Data is clocked out onto SDO by the falling edge of SCK. SDO is high impedance
when CS/LD is high. Logic levels are determined by IOVCC.
G5
LDAC
Active Low Asynchronous DAC Update Pin. When CS/LD is high, a falling edge on LDAC updates all DAC registers
with the contents of the input registers. When LDAC is low, a rising edge on CS/LD similarly updates all DAC
registers. Logic levels are determined by IOVCC. If the LDAC pin is not used, tie it high to IOVCC. Updates can
then be performed through SPI commands.
H2
CLR
Active Low Asynchronous Clear Input. A logic low at this level triggered input clears the device to zero-scale code
and a 0 V to 5 V span range. The control registers are cleared to default values. Logic levels are determined by
IOVCC.
H4
CS/LD
Serial Interface Chip Select/Load Input. When CS/LD is low, SCK is enabled for shifting data on SDI into the
register. When CS/LD is taken high, SCK is disabled and the specified command (see Table 8 and Table 9) is
executed. Logic levels are determined by IOVCC.



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