6.4 Thermal Information

THERMAL METRIC(1)

TPS3423 / TPS3424

UNIT

DRL (SOT-583)

DRL (SOT-563)

8 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

°C/W

RθJB

Junction-to-board thermal resistance

°C/W

ΨJT

Junction-to-top characterization parameter

°C/W

ΨJB

Junction-to-board characterization parameter

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Electrical Characteristics

At 1 V <VDD <6 V, SPT = LPT = Open, KILL = VDD CRESET = 50 pF, INT = 10K pull up to VDD and over the operating free-air

temperature range of - 40°C to 125°C, unless otherwise noted. Typical values are at TA = 25°C.

PARAMETER

TEST CONDITION

MIN

TYP

MAX

UNIT

POWER SUPPLY

VDD

Supply Voltage

1

6

V

IDD(Standby)

Standby supply

current(1)

VDD = 3V

TA = 25℃

22

30

nA

TA = –40℃ to 85℃

90

VDD = 6V

TA = –40℃ to 85℃

45

100

VDD = 6V

45

350

Push-button PIN

IDD(Active)

Supply current when

V PB = 0V ( two push-

button is pressed)(2)

VDD = 3V

12

µA

Supply current when

V PB = 0V ( one push-

button is pressed)(2)

7

Supply current when

VPB = VDD ( both-push

buttons are pressed)(3)

1.1

VIH(PB / PB)

PB Logic high input(2)

VDD = 3V

0.8*VDD

VIL(PB / PB)

PB Logic low Input(2)

0.3*VDD

RPB

PB pin internal pull-up /

pull-down resistance(2)

(3)

1000

kΩ

INT and RESET

VOL(INT)

Low level output

voltage

VDD = 1V, INT = 100µA

200

mV

Low level output

voltage

VDD = 3V, INT = 1mA

300

ILKG(INT)

Open drain output

leakage current for INT

VDD = V Pullup = 6V

100

nA

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TPS3423, TPS3424

SNVSCN9 – SEPTEMBER 2024

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