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TMP89FS60 Datasheet(PDF) 404 Page - Toshiba Semiconductor |
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TMP89FS60 Datasheet(HTML) 404 Page - Toshiba Semiconductor |
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404 / 410 page  Page 390 25. Electrical Characteristics 25.10 Handling Precaution TMP89FS60 RA003 25.10Handling Precaution - The solderability test conditions for lead-free products (indicated by the suffix G in product name) are shown below. 1. When using the Sn-37Pb solder bath Solder bath temperature = 230°C Dipping time = 5 seconds Number of times = once R-type flux used 2. When using the Sn-3.0Ag-0.5Cu solder bath Solder bath temperature = 245°C Dipping time = 5 seconds Number of times = once R-type flux used The pass criteron of the above test is as follows: Solderability rate until forming ≥ 95% - When using the device (oscillator) in places exposed to high electric fields such as cathode-ray tubes, we recommend electrically shielding the package in order to maintain normal operating condition. |
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