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AM69 Datasheet(PDF) 162 Page - Texas Instruments |
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AM69 Datasheet(HTML) 162 Page - Texas Instruments |
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162 / 326 page  6.8 Thermal Resistance Characteristics This section provides the thermal resistance characteristics used on this device. For reliability and operability concerns, the maximum junction temperature of the device has to be at or below the TJ value identified in Recommended Operating Conditions. 6.8.1 Thermal Resistance Characteristics for ALY Package It is recommended to perform thermal simulations at the system level with the worst case device power consumption. NO. PARAMETER DESCRIPTION ALY PACKAGE °C/W(1) (3) AIR FLOW (m/s)(2) T1 RΘJC Junction-to-case 0.11 N/A T2 RΘJB Junction-to-board 1.6 N/A T3 RΘJA Junction-to-free air 8.3 0 T4 Junction-to-moving air 4.7 1 T5 3.9 2 T7 ΨJT Junction-to-package top 0.1 0 T8 0.1 1 T9 0.1 2 T11 ΨJB Junction-to-board 1.3 0 T12 1.1 1 T13 1.0 2 (1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air) • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Packages (2) m/s = meters per second. (3) °C/W = degrees Celsius per watt. 6.8.2 Thermal Resistance Characteristics for AND Package It is recommended to perform thermal simulations at the system level with the worst case device power consumption. NO. PARAMETER DESCRIPTION AND PACKAGE °C/W(1) (3) AIR FLOW (m/s)(2) T1 RΘJC Junction-to-case 0.16 N/A T2 RΘJB Junction-to-board 1.47 N/A T3 RΘJA Junction-to-free air 9.22 0 T4 Junction-to-moving air 5.07 1 T5 4.31 2 T7 ΨJT Junction-to-package top 0.10 0 T8 0.10 1 T9 0.10 2 AM69A, AM69 SPRSP92D – FEBRUARY 2023 – REVISED DECEMBER 2024 www.ti.com 162 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: AM69A AM69 |
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