RE46C191 datasheet(33/44 Pages) MICROCHIP

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 2013-2023 Microchip Technology Inc. and its subsidiaries

DS20005225H-page 33

RE46C191

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Sheet 2 of 2

SEATING

PLANE

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Molded Package Width

Molded Package Thickness

Pitch

Standoff

Units

Dimension Limits

1.27 BSC

0.40

0.31

1.25

MILLIMETERS

MIN

NOM

1.27

0.51

1.75

MAX

1.04 REF

Footprint

Overall Length

9.90 BSC

Terminal Thickness

0.10

0.25

0.07

Lead Bend Radius

0.07

Lead Bend Radius

0°

8°

Foot Angle

0°

15°

Mold Draft Angle

Lead Angle

0.10

0.25

6.00 BSC

3.90 BSC

0°

16-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC]

Microchip Technology Drawing C04-108-SL Rev D

Corner Chamfer

0.25

0.50

DETAIL B

or protrusion, which shall not exceed 0.25 mm per side.

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimension D does not include mold flash, protrusions or gate burrs, which shall

Pin 1 visual index feature may vary, but must be located within the hatched area.

§ Significant Characteristic

Dimensioning and tolerancing per ASME Y14.5M

not exceed 0.15 mm per end. Dimension E1 does not include interlead flash

5. Datums A & B to be determined at Datum H.

(L1)

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