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BME690 Datasheet(PDF) 54 Page - Bosch Sensortec GmbH |
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BME690 Datasheet(HTML) 54 Page - Bosch Sensortec GmbH |
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54 / 60 page ![]() Bosch Sensortec | BME690 - Datasheet 54 | 60 © Bosch Sensortec GmbH 2025 | All rights reserved, also regarding any disposal, exploitation, reproduction, editing, distribution, Document number: BST-BME690-DS001-04 as well as in the event of applications for industrial property rights 7.4 Landing pattern recommendation For the design of the landing pattern, the dimensions shown in Picture 17: Recommended landing pattern (top view; dimensions are in millimeters) are recommended. It is important to note that areas marked in red are exposed PCB metal pads. • In case of a solder mask defined (SMD) PCB process, the land dimensions should be defined by solder mask openings. The underlying metal pads are larger than these openings. • In case of a non-solder mask defined (NSMD) PCB process, the land dimensions should be defined in the metal layer. The mask openings are larger than these metal pads. 1 2 4 3 8 7 5 6 Soldier stop Landing pattern 1.50 3.00 0.40 0.60 Picture 17: Recommended landing pattern (top view; dimensions are in millimeters) Solder stop Landing pattern |
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