Data Sheet

LT7153SP

analog.com

Rev 0

6 of 31

(Specifications are at TA = 25°C. VIN = 5V, unless otherwise noted.)

PARAMETER

SYMBOL

CONDITIONS/COMMENTS

MIN

TYP

MAX

UNITS

PGOOD Leakage

Current

IPGOOD

0.5

µA

PGOOD Pull-Down

Resistance

RPGOOD

VPG= 0.1V

5

Ω

PGOOD Delay

PG(Delay)

PGOOD Low to High

6

Cycles

PGOOD High to Low

25

Track/Soft-Start

Source Current

ITRACK/SS

VTRACK/SS = 0V

10

15

µA

Pull-Down Resistance

RTRACK/SS

VTRACK/SS = 0.1V

2500

Ω

.

1

The LT7153SP is tested under pulsed load conditions such that TJ ≈ TA. Specifications over the –40°C to 125°C

operating junction temperature range are assured by design, characterization, and correlation with statistical

process controls. The LT7153SP is guaranteed over the full –40°C to 125°C operating junction temperature

range. Note that the maximum ambient temperature consistent with these specifications is determined by

specific operating conditions in conjunction with board layout, the rated package thermal impedance, and

other environmental factors. The junction temperature (TJ, in °C) is calculated from the ambient temperature

(TA, in °C) and power dissipation (PD, in watts) according to the formula:

TJ = TA + (PD • θJA), where θJA (in °C/W) is the package thermal impedance.

2

The quiescent current in Discontinuous Mode does not include switching loss of the power FETs.

3

VFB is measured in a feedback loop that servos VITH to a specified voltage.

4

Inductor should be selected such that peak inductor current does not exceed 39A in application.