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LT8640 Datasheet(PDF) 16 Page - Analog Devices |
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LT8640 Datasheet(HTML) 16 Page - Analog Devices |
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16 / 32 page ![]() LT8640S/LT8643S/ LT8640SA/LT8643SA 16 Rev. D For more information www.analog.com APPLICATIONS INFORMATION GROUND VIA VIN VIA VOUT VIA OTHER SIGNAL VIAS 8640S F01a L COPT2 CIN3 COPT1 CSS R2 C1 R1 RT COUT GROUND VIA VIN VIA VOUT VIA OTHER SIGNAL VIAS 8640S F01b L COPT2 CIN3 COPT1 CSS R2 RC CC C1 R1 RT COUT CF (a) LT8640S/LT8640SA (b) LT8643S/LT8643SA Figure 1. Recommended PCB Layouts for the LT8640S/LT8640SA and LT8643S/LT8643SA Low EMI PCB Layout The LT8640S/LT8643S/LT8640SA/LT8643SA is specifi- cally designed to minimize EMI emissions and also to maximize efficiency when switching at high frequen- cies. For optimal performance the LT8640S/LT8643S/ LT8640SA/LT8643SA should use multiple VIN bypass capacitors. Two small <1µF capacitors can be placed as close as pos- sible to the LT8640S/LT8643S/LT8640SA/LT8643SA, one capacitor on each side of the device (COPT1, COPT2). A third capacitor with a larger value, 2.2µF or higher, should be placed near COPT1 or COPT2. See Figure 1 for recommended PCB layouts. For more detail and PCB design files refer to the Demo Board guide for the LT8640S/LT8643S/LT8640SA/LT8643SA. Note that large, switched currents flow in the LT8640S/ LT8643S/LT8640SA/LT8643SA VIN and GND pins and the input capacitors. The loops formed by the input capacitors should be as small as possible by placing the capacitors adjacent to the VIN and GND pins. Capacitors with small case size such as 0603 are optimal due to lowest parasitic inductance. The input capacitors, along with the inductor and out- put capacitors, should be placed on the same side of the circuit board, and their connections should be made on that layer. Place a local, unbroken ground plane under the application circuit on the layer closest to the surface layer. |
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