SN888C

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SLLSEI4 – SEPTEMBER 2013

ABSOLUTE MAXIMUM RATINGS

(1)

VALUE

UNIT

MIN

MAX

VCC

Supply voltage

–0.5

7

Input voltage range at any logic pin

–0.3

5.7

V

Voltage input range, transient pulse, A and B, through 100

Ω

–100

100

Voltage range at A or B inputs

–18

18

Receiver output current

–24

24

mA

Continuous total-power dissipation

See THERMAL INFORMATION table

IEC 61000-4-2 ESD (Contact Discharge), bus terminals and GND

±12

IEC 61000-4-4 EFT (Fast transient or burst) bus terminals and GND

±4

IEC 60749-26 ESD (HBM), bus terminals and GND

±16

kV

Test Method A114 (HBM), all pins

±8

JEDEC Standard 22

Test Method C101 (Charged Device Model), all pins

±1.5

Test Method A115 (Machine Model), all pins

±200

V

TJ

Junction temperature

170

°C

TSTG

Storage temperature

–65

150

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

SN888C

THERMAL METRIC(1)

UNITS

PACKAGE SOIC

(D)

θJA

Junction-to-ambient thermal resistance

116.1

θJCtop

Junction-to-case (top) thermal resistance

60.8

θJB

Junction-to-board thermal resistance(2)

57.1

°C/W

ψJT

Junction-to-top characterization parameter

13.9

ψJB

Junction-to-board characterization parameter

56.5

θJCbot

Junction-to-case (bottom) thermal resistance

NA

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

POWER DISSIPATION

PARAMETER

TEST CONDITIONS

VALUE

UNITS

RL = 300 Ω,

164

Unterminated

Power dissipation

CL = 50 pF (driver)

Driver and receiver enabled,

RL = 100 Ω,

247

PD

VCC = 5.5 V, TJ = 150°C

RS-422 load

mW

CL = 50 pF (driver)

50% duty cycle square-wave signal at

RL = 54 Ω,

316

250-kbps signaling rate:

RS-485 load

CL = 50 pF (driver)

Copyright © 2013, Texas Instruments Incorporated

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