LM96063

SNIS149B – NOVEMBER 2011 – REVISED MARCH 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Supply Voltage, VDD

−0.3 V to 6.0 V

Voltage on SMBDAT, SMBCLK,

ALERT,

TCRIT, TACH

PWM Pins

−0.5 V to 6.0 V

Voltage on Other Pins

−0.3 V to (VDD + 0. 3 V)

Input Current, D

− Pin(3)

±1 mA

Input Current at All Other Pins (3)

5 mA

Package Input Current

(3)

30 mA

SMBDAT, ALERT, PWM pins

Output Sink Current

10 mA

Package Power Dissipation

(4)

Junction Temperature

125°C

Storage Temperature

−65°C to +150°C

ESD Susceptibility(5)

Human Body Model

2500 V

Machine Model

250 V

Charged Device Model

1000 V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure performance limits. For ensured specifications and test conditions, see the Electrical

Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade

when the device is not operated under the listed test conditions.

(2)

All voltages are measured with respect to GND, unless otherwise noted.

(3)

When the input voltage (VIN) at any pin exceeds the power supplies (VIN < GND or VIN > V+), the current at that pin should be limited to

5 mA. Parasitic components and/or ESD protection circuitry are shown below for the LM96063's pins. Care should be taken not to

forward bias the parasitic diode, D2, present on pins D+ and D

−. Doing so by more than 50 mV may corrupt temperature

measurements.

(4)

Thermal resistance junction to ambient when attached to a 2 layer 4"x3" printed circuit board with copper thickness of 2oz. as described

in JEDEC specification EIA/JESD51-3 is 137°C/W. Thermal resistance junction to ambient when attached to a 4 layer 4"x3" printed

circuit board with copper thickness 2oz./1oz./1oz/2oz. and 4 thermal vias as described in JEDEC specification EIA/JESD51-7 is

40.3°C/W.

(5)

Human body model, 100 pF discharged through a 1.5 k

Ω resistor. Machine model, 200 pF discharged directly into each pin. Charged

Device Model (CDM) simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated

assembler) then rapidly being discharged.

Operating Ratings

(1) (2) (3) (4)

Specified Temperature Range

TMIN ≤ TA ≤ TMAX

LM96063CISD

–40°C

≤ TA ≤ +85°C

Remote Diode Temperature Range

-40°C

≤ TD ≤ +140°C

Supply Voltage Range (VDD)

+3.0 V to +3.6 V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure performance limits. For ensured specifications and test conditions, see the Electrical

Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade

when the device is not operated under the listed test conditions.

(2)

All voltages are measured with respect to GND, unless otherwise noted.

(3)

Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.

(4)

Reflow temperature profiles are different for packages containing lead (Pb) than for those that do not.

4

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