LP38500-ADJ, LP38502-ADJ

SNVS539H – NOVEMBER 2007 – REVISED SEPTEMBER 2015

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Table of Contents

7.4

Device Functional Modes........................................ 12

1

Features .................................................................. 1

8

Application and Implementation ........................ 13

2

Applications ........................................................... 1

8.1

Application Information............................................ 13

3

Description ............................................................. 1

8.2

Typical Applications ............................................... 13

4

Revision History..................................................... 2

9

Power Supply Recommendations ...................... 16

5

Pin Configurations and Functions ....................... 3

9.1

Power Dissipation/Heatsinking................................ 16

6

Specifications......................................................... 4

10

Layout................................................................... 17

6.1

Absolute Maximum Ratings ...................................... 4

10.1

Layout Guidelines ................................................. 17

6.2

ESD Ratings.............................................................. 4

10.2

Layout Examples................................................... 17

6.3

Recommended Operating Conditions ....................... 4

11

Device and Documentation Support ................. 20

6.4

Thermal Information .................................................. 4

11.1

Documentation Support ........................................ 20

6.5

Electrical Characteristics........................................... 5

11.2

Community Resources.......................................... 20

6.6

Typical Characteristics .............................................. 7

11.3

Trademarks ........................................................... 20

7

Detailed Description .............................................. 9

11.4

Electrostatic Discharge Caution ............................ 20

7.1

Overview ................................................................... 9

11.5

Glossary ................................................................ 20

7.2

Functional Block Diagrams ....................................... 9

12

Mechanical, Packaging, and Orderable

7.3

Feature Description................................................. 10

Information ........................................................... 20

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision G (June 2015) to Revision H

Page

•

Changed thermal values for KTT (DDPAK/TO-263); add notes 2 and 3 to Thermal Information table ................................ 4

Changes from Revision F (April 2013) to Revision G

Page

•

Added Added Device Information and Pin Configuration and Functions sections, ESD Ratings and updated Thermal

Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply

Recommendations, Layout, Device and Documentation Support , and Mechanical, Packaging, and Orderable

Information sections................................................................................................................................................................ 1

•

Deleted obsolete heatsinking information for DDPAK/TO-263 package ............................................................................. 16

Changes from Revision E (April 2013) to Revision F

Page

•

Changed layout of National Data Sheet to TI format ........................................................................................................... 19

2

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