LP38500-ADJ, LP38502-ADJ

SNVS539H – NOVEMBER 2007 – REVISED SEPTEMBER 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Input pin voltage (survival)

−0.3

6

V

Enable pin voltage (survival)

−0.3

6

V

Output pin voltage (survival)

−0.3

6

V

IOUT (survival)

Internally limited

Power dissipation(3)

Internally limited

Storage temperature, Tstg

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Office/ Distributors for availability and

specifications.

(3)

Operating junction temperature must be evaluated, and derated as needed, based on ambient temperature (TA), power dissipation (PD),

maximum allowable operating junction temperature (TJ(MAX)), and package thermal resistance (RθJA). See Application and

Implementation.

6.2 ESD Ratings

VALUE

UNIT

VESD

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. have higher

performance.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

Input supply voltage

2.7

5.5

V

Enable input voltage

0

5.5

V

Output current (DC)

0

1.5

A

VOUT

0.6

5

V

Junction temperature(1)

−40

125

°C

(1)

Operating junction temperature must be evaluated, and derated as needed, based on ambient temperature (TA), power dissipation (PD),

maximum allowable operating junction temperature (TJ(MAX)), and package thermal resistance (RθJA). See Application and

Implementation.

6.4 Thermal Information

LP38500 and LP38502

THERMAL METRIC(1)

KTT(DDPAK/TO-263)

NDQ (TO-263)

NGS (WSON)

UNIT

5 PINS

5 PINS

8 PINS

RθJA

(2)

Junction-to-ambient thermal resistance

41.8

33.3

52.5(3)

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

45.0

22.1

53.6

°C/W

RθJB

Junction-to-board thermal resistance

24.8

16.9

26.1

°C/W

ψJT

Junction-to-top characterization parameter

13.1

5.8

0.6

°C/W

ψJB

Junction-to-board characterization parameter

23.8

16.8

26.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

2.4

2.3

7.4

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Thermal resistance value RθJA is based on the EIA/JEDEC High-K printed circuit board defined by: JESD51-7, High Effective Thermal

Conductivity Test Board for Leaded Surface Mount Packages.

(3)

The PCB for the NGN (WSON) package RθJA includes thermal vias under the exposed thermal pad per EIA/JEDEC JESD51-5.

4

Submit Documentation Feedback

Copyright © 2007–2015, Texas Instruments Incorporated

Product Folder Links: LP38500-ADJ LP38502-ADJ