www.ti.com

PACKAGE OUTLINE

C

2.1

1.9

2.1

1.9

0.8

0.7

0.05

0.00

2X 1.6

8X 0.4

10X

0.4

0.2

10X

0.25

0.15

1.5 0.1

0.9 0.1

(0.2) TYP

WSON - 0.8 mm max height

DSQ0010A

PLASTIC SMALL OUTLINE - NO LEAD

4218906/A 04/2019

0.08 C

0.1

C A B

0.05

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

PIN 1 INDEX AREA

SEATING PLANE

PIN 1 ID

SYMM

EXPOSED

THERMAL PAD

SYMM

1

5

6

10

11

SCALE 5.000

A

B