INA181 datasheet(7/62 Pages) TI2

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage, VS

Analog inputs, IN+, IN– (2)

Differential (VIN+) – (VIN–)

–26

Common-mode (3)

GND – 0.3

Input voltage range

at REF pin

GND – 0.3

VS + 0.3

Output Voltage

GND – 0.3

VS + 0.3

Maximum output current, IOUT

Operating fee-air temperature, TA

–55

150

°C

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively.

(3)

Input voltage at any pin can exceed the voltage shown if the current at that pin is limited to 5 mA.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±3000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCM

Common-mode input voltage (IN+ and IN–)

–0.2

Operating supply voltage

2.7

5.5

Operating free-air temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC (1)

INA181

INA2181

INA4181

UNIT

DCK (SC70)

DBV (SOT-23)

DSQ (WSON)

DGS (VSSOP)

PW (TSSOP)

6 PINS

10 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

188.0

198.7

74.5

177.3

97.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

140.8

120.9

89.7

68.7

37.7

°C/W

RθJB

Junction-to-board thermal resistance

78.8

52.3

39.8

98.4

48.3

°C/W

ψJT

Junction-to-top characterization parameter

62.1

30.3

3.7

12.6

3.6

°C/W

ψJB

Junction-to-board characterization parameter

78.5

52.0

39.7

96.9

47.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

16.8

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

INA181, INA2181, INA4181

SBOS793H – APRIL 2017 – REVISED NOVEMBER 2023

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Product Folder Links: INA181 INA2181 INA4181

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