4

OPA320-Q1, OPA2320-Q1

SLOS884B – SEPTEMBER 2014 – REVISED DECEMBER 2018

www.ti.com

Product Folder Links: OPA320-Q1 OPA2320-Q1

Submit Documentation Feedback

Copyright © 2014–2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed as absolute maximum ratings may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated as recommended operating conditions is

not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should

be current limited to 10 mA or less.

(3)

Short-circuit to ground, one amplifier per package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

V+ and V–

6

V

Voltage(2)

Signal input pins

V(V–) – 0.5

V(V+) + 0.5

V

Current(2)

Signal input pins

–10

10

mA

Output short-circuit current(3)

Continuous

Temperature

Operating, TA

–40

150

°C

Junction, TJ

150

Storage, Tstg

–65

150

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

±2000

V

Charged-device model (CDM),

per AEC Q100-011

All pins

±500

Corner pins (1, 4, 5, and 8)

±750

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VS

Supply voltage

Single-supply

1.8

5.5

V

Dual-supply

±0.9

±2.75

TA

Ambient operating temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

OPA320-Q1

OPA2320-Q1

UNIT

DBV (SOT)

DGK (VSSOP)

5 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

158.8

174.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

60.7

43.9

°C/W

RθJB

Junction-to-board thermal resistance

44.8

95

°C/W

ψJT

Junction-to-top characterization parameter

1.6

2

°C/W

ψJB

Junction-to-board characterization parameter

4.2

93.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

—

°C/W