OPA320SAIDBVT datasheet(6/58 Pages) TI2

6 / 58 page

OPA320, OPA2320, OPA320S, OPA2320S

SBOS513F – AUGUST 2010 – REVISED DECEMBER 2016

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Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should

be current limited to 10 mA or less.

(3)

Short-circuit to ground, one amplifier per package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Voltage

Supply, VS = (V+) – (V–)

Signal input pin(2)

(V–) – 0.5

(V+) + 0.5

Current

Signal input pin(2)

–10

Output short-circuit current(3)

Continuous

Temperature

Operating range, TA

–40

150

°C

Junction, TJ

150

Storage, Tstg

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±4000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

Machine model (MM)

±200

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Specified voltage

1.8

5.5

Specified temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the application report, Semiconductor and IC Package Thermal

Metrics.

6.4 Thermal Information: OPA320 and OPA320S

THERMAL METRIC

OPA320

OPA320S

UNIT

DBV (SOT-23)

5 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance(1)

219.3

177.5

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

107.5

108.9

°C/W

RθJB

Junction-to-board thermal resistance

57.5

27.4

°C/W

ψJT

Junction-to-top characterization parameter

7.4

13.3

°C/W

ψJB

Junction-to-board characterization parameter

56.9

26.9

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

—

°C/W

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