NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

PACKAGE OUTLINE

4225901/A 05/2020

www.ti.com

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK- NO LEAD

RGF0040F

A

0.08 C

0.1

C A B

0.05

C

B

SYMM

SYMM

5.1

4.9

7.1

6.9

1 MAX

0.05

0.00

C

SEATING PLANE

3.7±0.1

3.5

5.5

36X 0.5

5.7±0.1

40X 0.5

0.3

40X 0.3

0.2

1

12

13

20

21

32

33

40

41

PIN 1 INDEX AREA

(0.2) TYP

(0.16)

0.100 MIN

(0.130)

SECTION A-A

TYPICAL