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DM505LRBABF Datasheet(PDF) 270 Page - Texas Instruments |
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DM505LRBABF Datasheet(HTML) 270 Page - Texas Instruments |
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270 / 295 page ![]() = Rtt A2 A3 AT Vtt SPRS91v_PCB_DDR3_11 = Rcp Rcp Cac DDR_1V5 0.1 µF A2 A3 A2 A3 AT AT SPRS91v_PCB_DDR3_10 270 DM505 SPRS976E – NOVEMBER 2016 – REVISED MAY 2018 www.ti.com Submit Documentation Feedback Applications, Implementation, and Layout Copyright © 2016–2018, Texas Instruments Incorporated Figure 7-53. CK Routing for Two Mirrored DDR3 Devices Figure 7-54. ADDR_CTRL Routing for Two Mirrored DDR3 Devices 7.9.2.13.2 Two DDR3 Devices Two DDR3 devices are supported on the DDR EMIF consisting of two x8 DDR3 devices arranged as one bank (CS), 16 bits wide, or two x16 DDR3 devices arranged as one bank (CS), 32 bits wide. These two devices may be mounted on a single side of the PCB, or may be mirrored in a pair to save board space at a cost of increased routing complexity and parts on the backside of the PCB. 7.9.2.13.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices Figure 7-55 shows the topology of the CK net classes and Figure 7-56 shows the topology for the corresponding ADDR_CTRL net classes. |
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