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TDA2SA Datasheet(PDF) 358 Page - Texas Instruments |
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TDA2SA Datasheet(HTML) 358 Page - Texas Instruments |
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358 / 427 page ![]() A B C D E F qspi1_sclk qspi1_rtclk R2 R2 R1 QSPI device clock input QSPI device IOx, CS# qspi1_d[x], qspi1_cs[y] 0 * Ω 10 Ω 10 Ω Locate both R2 resistors close together near the QSPI device SPRS906_PCB_QSPI_01 358 TDA2SX, TDA2SG, TDA2SA TDA2HG, TDA2HV, TDA2HF, TDA2LF SPRS951F – DECEMBER 2015 – REVISED MAY 2019 www.ti.com Submit Documentation Feedback Product Folder Links: TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF Applications, Implementation, and Layout Copyright © 2015–2019, Texas Instruments Incorporated • Propagation delays and matching: – A to C = C to D = E to F. – Matching skew: < 60pS – A to B < 450pS – B to C = as small as possible (<60pS) Figure 8-29. QSPI Interface High Level Schematic (1) 0 Ω resistor (R1), located as close as possible to the qspi1_sclk pin, is placeholder for fine-tuning if needed. 8.5 Differential Interfaces 8.5.1 General Routing Guidelines To maximize signal integrity, proper routing techniques for differential signals are important for high-speed designs. The following general routing guidelines describe the routing guidelines for differential lanes and differential signals. • As much as possible, no other high-frequency signals must be routed in close proximity to the differential pair. • Must be routed as differential traces on the same layer. The trace width and spacing must be chosen to yield the differential impedance value recommended. • Minimize external components on differential lanes (like external ESD, probe points). • Through-hole pins are not recommended. • Differential lanes mustn’t cross image planes (ground planes). • No sharp bend on differential lanes. • Number of vias on the differential pairs must be minimized, and identical on each line of the differential pair. In case of multiple differential lanes in the same interface, all lines should have the same number of vias. |
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