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TDA2SA Datasheet(PDF) 354 Page - Texas Instruments

Part # TDA2SA
Description  TDA2x ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0
PDF  427 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TDA2SA Datasheet(HTML) 354 Page - Texas Instruments

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PCB_CPD_5
354
TDA2SX, TDA2SG, TDA2SA
TDA2HG, TDA2HV, TDA2HF, TDA2LF
SPRS951F – DECEMBER 2015 – REVISED MAY 2019
www.ti.com
Submit Documentation Feedback
Product Folder Links: TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF
Applications, Implementation, and Layout
Copyright © 2015–2019, Texas Instruments Incorporated
Table 8-9. PCB Etch Resistance Breakdown - From Power Inductor to Device Load (continued)
Net[from]
Component [from]:
Net[to]
Component [to]:
Etch Resistance (Ω)
% of Total Etch
Resistance
vdd_mpu
R181
vdd_mpu
U52
0,006311
90%
vdd_mpu
R181
vdd_mpu
U52
0,006311
92%
vdd_mpu
R181
vdd_mpu
U52
0,006311
92%
Total Etch Resistance =
0,007007
100%
Total Etch Resistance =
0,006852
100%
Total Etch Resistance =
0,006837
100%
Max Value =
0,007007
Table 8-10. PDN Effective Resistance - From PMIC Source to Device Load
PDN Elements
PDN Effective Resistance
(Ω)
% of Total Etch Resistance
Etch
0,008045
89%
Inductor
0
0%
Sense Resistor
0,001
11%
Max PDN Effectiv Resistance from Source
0,009045
100%
IR Drop: vdd_mpu (PCB RevJan14, Sentinel PSI)
•
Source Conditions: 1.22V @ 5,12A
•
Recommended Reff < 10mΩ
•
Reff = Total Trace Resistance + Sence Resistor = 8,04mΩ + 1mΩ = 9,04mΩ
•
Voltage / IR Drop: 1,22 - 1,179 = 52,6 mV
Figure 8-25. vdd_mpu Voltage/IR Drop [All Layers]
Dynamic analysis of this PCB design for the MPU power domain determined the vdd_mpu decoupling
capacitor loop inductance and impedance vs frequency analysis shown below. As you can see, the loop
inductance values ranged from 1.0 to 1.4nH and were less than maximum 2.0nH recommended.



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