TDA2SA datasheet(360/427 Pages) TI2

360 / 427 page

Analog

Power Supply

SoC Board

Ferrite Bead

Digital

Power Supply

Ferrite Bead

0.1 µF

0.01 µF

0.001 µF

1 µF

0.1 µF

0.01 µF

0.001 µF

1 µF

SPRS906_PCB_USB20_01

AGND

DGND

360

TDA2SX, TDA2SG, TDA2SA

TDA2HG, TDA2HV, TDA2HF, TDA2LF

SPRS951F – DECEMBER 2015 – REVISED MAY 2019

www.ti.com

Submit Documentation Feedback

Product Folder Links: TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF

Applications, Implementation, and Layout

8.5.2.2.2.1 Analog, PLL, and Digital Power Supply Filtering

To minimize EMI emissions, add decoupling capacitors with a ferrite bead at power supply terminals for

the analog, phase-locked loop (PLL), and digital portions of the chip. Place this array as close to the chip

as possible to minimize the inductance of the line and noise contributions to the system. An analog and

digital supply example is shown in Figure 8-30. In case of multiple power supply pins with the same

function, tie them up to a single low-impedance point in the board and then add the decoupling capacitors,

in addition to the ferrite bead. This array of caps and ferrite bead improve EMI and jitter performance.

Take both EMI and jitter into account before altering the configuration.

Figure 8-30. Suggested Array Capacitors and a Ferrite Bead to Minimize EMI

TDA2SA Datasheet(PDF) 360 Page - Texas Instruments