TDA2SA datasheet(374/427 Pages) TI2

374 / 427 page

TopLayer: Routing from SoC through CMF,

and ESD to connector.

Layer2, GND: Gaps carved in GND underneath,

CMF, ESD, and connector.

AC Cap

CMF

AC Cap

CMF

SPRS85x_PCB_HDMI_3

374

TDA2SX, TDA2SG, TDA2SA

TDA2HG, TDA2HV, TDA2HF, TDA2LF

SPRS951F – DECEMBER 2015 – REVISED MAY 2019

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Product Folder Links: TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF

Applications, Implementation, and Layout

Table 8-17. TDMS Routing Recommendations (continued)

Item

Description

Reason

Carve Ground

Carve GND underneath ESD and CMF

Minimize capacitance under ESD

and CMF

Round pads

Reduce pad size and round the corners of the pads for the ESD and

CMF components

Minimize capacitance

Routing layer

Route all signals only on the same layer as SoC

Minimize reflection loss

Figure 8-44presents an example layout, demonstrating the “carve GND” concept.

Figure 8-44. HDMI Example “carve GND” layout

8.5.4.3

TPD5S115

The TPD5S115 is an integrated HDMI companion chip solution. The device provides a regulated 5 V

output (5VOUT) for sourcing the HDMI power line. The TPD5S115 exceeds the IEC61000-4-2 (Level 4)

ESD protection level.

8.5.4.4

HDMI ESD Protection Device (Required)

Interfaces that connect to a cable such as HDMI generally require more ESD protection than can be built

into the processor’s outputs. Therefore this HDMI interface requires the use of an ESD protection chip to

provide adequate ESD.

When selecting an ESD protection chip, choose the lowest capacitance ESD protection available to

minimize signal degradation. In no case should be ESD protection circuit capacitance be more than 5pF.

TI manufactures these devices that provide ESD protection for HDMI signals such as the TPDxE05U06.

For more information see the www.ti.com website.

8.5.4.5

PCB Stackup Specifications

Table 8-18 shows the stackup and feature sizes required for HDMI.

Table 8-18. HDMI PCB Stackup Specifications

PARAMETER

MIN

TYP

MAX

UNIT

PCB Routing/Plane Layers

Layers

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