TLE7809G datasheet(34/52 Pages) INFINEON

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TLE7809G

General Product Characteristics

Data Sheet

Rev. 3.01, 2008-04-15

Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the

data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are

not designed for continuous repetitive operation.

16.2

Functional Range

16.3

Thermal Resistance

Table 13

Operating Range

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Max.

16.2.1

Supply voltage

3.9

40 V load dump;

≤ 0.4 s;

27V jump start;

≤ 60s;

S (min) valid for ramp-down

16.2.2

Voltage range at LSx pins

LSx

-0.3

40 V load dump;

≤ 0.4s;

can withstand short circuit

S ≤ 20V

16.2.3

External output current at pin

CC ICC_ext

–

external loads

16.2.4

Supply voltage slew rate

S/dt

-0.5

μs–

16.2.5

Logic input voltage (TMS, TCK,

TDI, CLKIN)

-0.3

CC +

0.3 V

V–

16.2.6

Output capacitor connected to

CC pin

1–

μF

ESR < 6

f = 10 kHz;

100 nF in parallel

recommended

16.2.7

SPI clock frequency

clk

–4

MHz

–

16.2.8

Junction temperature

-40

125

°C–

16.2.9

Delay time for operating mode

change

chmode

–

μs

min. time between 2 SPI

commands; CSN “high”

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Typ.

Max.

16.3.1

Junction to Soldering Point1)

1) Not subject to production test, specified by design

thJSP

–

K/W

measured to pin

7,8,22

16.3.2

Junction to Ambient1)

thJA

–43

–

K/W

2) Specified RthJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The Product

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).

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