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LPC1850 Datasheet(PDF) 142 Page - NXP Semiconductors |
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LPC1850 Datasheet(HTML) 142 Page - NXP Semiconductors |
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142 / 142 page ![]() NXP Semiconductors LPC1850/30/20/10 32-bit ARM Cortex-M3 microcontroller © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 9 September 2011 Document identifier: LPC1850_30_20_10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 83 9 Thermal characteristics . . . . . . . . . . . . . . . . . 84 10 Static characteristics . . . . . . . . . . . . . . . . . . . . 85 10.1 Power consumption . . . . . . . . . . . . . . . . . . . . 89 10.2 Power consumption . . . . . . . . . . . . . . . . . . . . 93 10.3 Electrical pin characteristics . . . . . . . . . . . . . . 96 11 Dynamic characteristics . . . . . . . . . . . . . . . . . 98 11.1 External clock . . . . . . . . . . . . . . . . . . . . . . . . . 98 11.2 IRC and RTC oscillators . . . . . . . . . . . . . . . . . 99 11.3 I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 11.4 I2S-bus interface . . . . . . . . . . . . . . . . . . . . . . 101 11.5 SSP interface . . . . . . . . . . . . . . . . . . . . . . . . 103 11.6 External memory interface . . . . . . . . . . . . . . 106 11.7 USB interface . . . . . . . . . . . . . . . . . . . . . . . 111 11.8 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 11.9 SD/MMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 12 ADC/DAC electrical characteristics . . . . . . . 114 13 Application information. . . . . . . . . . . . . . . . . 117 13.1 LCD panel signal usage . . . . . . . . . . . . . . . . 117 13.2 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . 119 13.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines . . . . . . . . . . . . . . . . 121 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . 122 15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 16 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 134 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . 136 18 Legal information. . . . . . . . . . . . . . . . . . . . . . 139 18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . 139 18.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 139 18.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 139 18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . 140 19 Contact information. . . . . . . . . . . . . . . . . . . . 140 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141 |
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