NVT2001_NVT2002

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 2 — 26 October 2011

19 of 23

NXP Semiconductors

NVT2001; NVT2002

Bidirectional voltage level translator

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

15. Soldering: reflow soldering footprint for SOT1089

MSL: Moisture Sensitivity Level

Fig 18. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Fig 19. SOT1089 reflow soldering footprint

sot1089_fr

Footprint information for reflow soldering of XSON8 package

SOT1089

solder resist

occupied area

solder paste = solder land

Dimensions in mm

0.15

(8

×)

0.35

(3

×)

0.25

(8

×)

0.5

(8

×)

0.6

(8

×)

0.7

1.4

1.4