AM3359 datasheet(191/195 Pages) TI

191 / 195 page

AM3359, AM3358, AM3357

AM3356, AM3354, AM3352

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SPRS717B

– OCTOBER 2011 – REVISED JANUARY 2012

Mechanical Packaging and Orderable Information

7.1

Thermal Data for ZCE and ZCZ Packages

Table 7-1 provides thermal characteristics for the packages used on this device.

NOTE

Table 7-1 provides simulation data and may not represent actual use-case values.

Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZCE and ZCZ]

NAME

DESCRIPTION

AIR

ZCE

ZCZ

FLOW(1)

(

°C/W)(2)

(

°C/W)(2)

ΘJC

Junction-to-case (1S0P)(3)

N/A

10.3

10.2

ΘJB

Junction-to-board (2S2P)(3)

N/A

11.6

12.1

ΘJA

Junction-to-free air (2S2P)(3)

0.0

24.7

24.2

1.0

20.5

20.1

2.0

19.7

19.3

3.0

19.2

18.8

ΨJT

Junction-to-package top (2S2P)(3)

0.0

0.4

0.3

1.0

0.6

2.0

0.7

3.0

0.9

0.8

ΨJB

Junction-to-board (2S2P)(3)

0.0

11.9

12.7

1.0

11.7

12.3

2.0

11.7

12.3

3.0

11.6

12.2

(1)

m/s = meters per second.

(2)

°C/W = degress celsius per watt.

(3)

The board types are defined by JEDEC (reference JEDEC standard JESD51-9, Test Board for Area

Array Surface Mount Package Thermal Measurements).

7.2

Via Channel

The ZCE package has been specially engineered with Via Channel

™ technology. This allows larger than

normal PCB via and trace sizes and reduced PCB signal layers to be used in a PCB design with the

0.65-mm pitch package, and substantially reduces PCB costs. It allows PCB routing in only two signal

layers (four layers total) due to the increased layer efficiency of the Via Channel

™ BGA technology.

Via Channel

™ technology implemented on the ZCE package makes it possible to build an AM335x-based

product with a 4-layer PCB, but a 4-layer PCB may not meet system performance goals. Therefore,

system performance using a 4-layer PCB design must be evaluated during product design.

7.3

Packaging Information

The following packaging information and addendum reflect the most current data available for the

designated device(s). This data is subject to change without notice and without revision of this document.

The figures below show the package drawings for the ZCE and ZCZ package options.

Mechanical Packaging and Orderable Information

191

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