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MAX14821

IO-Link Device Transceiver

(All voltages referenced to GND, unless otherwise noted.)

VCC.........................................................................-40V to +40V

VP (IVP < 50mA) ..... the higher of -0.3V and (VCC - 1V) to +40V

LDOIN....................................................................-0.3V to +40V

V5..................... -0.3V to the lesser of (VLDOIN + 0.3V) and +6V

LDO33 ..................... -0.3V to the lesser of (V5 + 0.3V) and +6V

VL.............................................................................-0.3V to +6V

DI ...........................................................................-40V to +40V

C/Q, DO...................... MIN: the higher of -40V and (VCC - 40V)

MAX: the lesser of +40V and (VCC + 40V)

Logic Inputs

TXC, TXQ, TXEN, LO, CS, SDI, SCLK..... -0.3V to (VL + 0.3V)

Logic Outputs

RX, WU, LI, SDO, IRQ ............................. -0.3V to (VL + 0.3V)

UV........................................................................-0.3V to +6V

Continuous Current Into Any Logic Pin........................... Q50mA

Continuous Power Dissipation

TQFN (derate 27.8mW/NC above +70NC)..................2222mW

WLP (derate 22.7mW/NC above +70NC)....................1816mW

Operating Temperature Range.......................... -40NC to +85NC

Maximum Junction Temperature.....................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (TQFN only; soldering, 10s) .............+300NC

Soldering Temperature (reflow) ......................................+260NC

TQFN

Junction-to-Ambient Thermal Resistance (BJA) ..........36NC/W

Junction-to-Case Thermal Resistance (BJC) .................3NC/W

WLP

Junction-to-Ambient Thermal Resistance (BJA) ..........44NC/W

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

DC ELECTRICAL CHARACTERISTICS

(VCC = 18V to 36V, VL = 2.3V to 5.5V, VGND = 0V; all logic inputs at VL or GND; TA = -40NC to +85NC, unless otherwise noted. Typical

values are at VCC = 24V, VL = 3.3V, and TA = +25NC, unless otherwise noted.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

VCC Supply Voltage

VCC

For driver operation

VCC Supply Current

ICC

VCC = 24V, C/Q as input, no load on V5

or LDO33, LDOIN not connected to VP,

VLDOIN = 24V

2.5

VCC Undervoltage-Lockout

Threshold

VCCUVLO

VCC falling

7.4

VCC Undervoltage-Lockout

Threshold Hysteresis

VCCUVLO_HYST

200

V5 Supply Current

I5_IN

LDOIN shorted to V5, external 5V applied

to V5, no switching, LDO33 disabled

V5 Undervoltage-Lockout

Threshold

V5UVLO

V5 falling

2.0

VL Logic-Level Supply Voltage

2.3

5.5

VL Logic-Level Supply Current

All logic inputs at VL or GND

VL Undervoltage Threshold

VLUVLO

VL falling

0.65

0.95

1.30

5V LDO (V5)

LDOIN Input Voltage Range

VLDOIN

LDOIN Supply Current

ILDOIN

VLDOIN = 24V, C/Q is configured as an

input, no load on V5 or LDO33

2.5

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