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ADS6142-HT Datasheet(PDF) 3 Page - Texas Instruments |
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ADS6142-HT Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 49 page ![]() 0 0 Edge of Scribe ADS6142-HT www.ti.com SLWS234 – DECEMBER 2011 BARE DIE INFORMATION BOND PAD DIE DIE PAD DIE PAD DIE BACKSIDE BOND PAD BACKSIDE FINISH METALLIZATION SIZE SIZE COORDINATES THICKNESS POTENTIAL THICKNESS COMPOSITION 2715 x 2460 µm Silicon with 70 x 70 µm See Table 2 11 mils DRVSS Ti/Al-Cu/TiN 1100 nm backgrind 96.85 x 106.89 mils Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s) :ADS6142-HT |
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