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AS3668 Datasheet(PDF) 6 Page - ams AG

Part # AS3668
Description  4 Channel Breathl ight Cont rol ler
PDF  60 Pages
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Manufacturer  AMSCO [ams AG]
Direct Link  http://www.ams.com
Logo AMSCO - ams AG

AS3668 Datasheet(HTML) 6 Page - ams AG

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www.austriamicrosystems.com/AS3668
Revision 1.11
6 - 60
AS3668
Data Sheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 7 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
VBAT, VCP, CN, CP to GND
-0.3
7
V
VCP to GND
-0.3
7
V
Protection diode between VCP and GND
LED1, LED2, CURR3, CURR4 to GND
-0.3
7
V
SCL, SDA, GPIO/AUDIO_IN to GND
-0.3
7
V
Input Pin Current without causing
latch up
-100
+100
mA
At 25ºC, Norm: EIA/JESD78
Electrostatic Discharge
ESD HBM (CURR1 to CURR4)
2
kV
JEDEC JESD22-A114
ESD HBM (all other pins)
2
kV
ESD MM
100
V
JEDEC JESD22-A115
ESD CDM
500
V
JEDEC JESD22-C101
Storage Temperature Range
-55
+125
ºC
Temperature Ranges and Storage Conditions
Continuous Power Dissipation
0.83
W
Internally limited (over temperature protection)
1
1. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 140°C (typ.) and
disengages at TJ = 135°C (typ.).
Storage Temperature Range
-55
+125
ºC
Junction to Ambient Thermal Resistance (
θ
JA)
2
2. Junction to ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
60
°C/W
Humidity non-condensing
5
85
%
Moisture Sensitive Level
1
Represents a max. floor life time of unlimited.
Package Body Temperature
+260
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.



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