AD7715 datasheet(6/31 Pages) AD

6 / 31 page

REV. C

AD7715

–6–

ORDERING GUIDE

AVDD

Temperature

Package

Model

Supply

Range

Options*

AD7715AN-5

5 V

–40

°C to +85°C

N-16

AD7715AR-5

5 V

–40

°C to +85°C

R-16

AD7715ARU-5

5 V

–40

°C to +85°C

RU-16

AD7715AN-3

3 V

–40

°C to +85°C

N-16

AD7715AR-3

3 V

–40

°C to +85°C

R-16

AD7715ARU-3

3 V

–40

°C to +85°C

RU-16

AD7715AChips-5

5 V

–40

°C to +85°CDie

AD7715AChips-3

3 V

–40

°C to +85°CDie

EVAL-AD7715-5EB

5 V

Evaluation Board

EVAL-AD7715-3EB

3 V

Evaluation Board

*N = Plastic DIP; R = SOIC RU = TSSOP.

ABSOLUTE MAXIMUM RATINGS*

(TA = +25°C unless otherwise noted)

AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

AVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

DVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

DGND to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Analog Input Voltage to AGND . . . . . –0.3 V to AVDD + 0.3 V

Reference Input Voltage to AGND . . . –0.3 V to AVDD + 0.3 V

Digital Input Voltage to DGND . . . . . –0.3 V to DVDD + 0.3 V

Digital Output Voltage to DGND . . . . –0.3 V to DVDD + 0.3 V

Operating Temperature Range

Commercial (A Version) . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Plastic DIP Package, Power Dissipation . . . . . . . . . . . 450 mW

JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105

°C/W

Lead Temperature, (Soldering, 10 sec) . . . . . . . . . . +260

°C

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 450 mW

JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

TSSOP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW

JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 128

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

Power Dissipation (Any Package) to +75

°C . . . . . . . . 450 mW

ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >4000 V

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

PIN CONFIGURATION

DIP, SOIC and TSSOP

TOP VIEW

(Not to Scale)

AD7715

SCLK

DOUT

DIN

DVDD

DGND

MCLK IN

MCLK OUT

REF IN(+)

AGND

DRDY

RESET

AVDD

AIN(+)

AIN(–)

REF IN(–)

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