SPRUG18 datasheet(42/214 Pages) TI

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C64x+ DSP:

C6474

PREFIX

TMS

320

C6474

ZUN

TMX = Experimental device

TMS = Qualified device

DEVICE FAMILY

320 = TMS320

DSP family

PACKAGE TYPE

(B)

CUN = 561-pin plastic BGA (lead-free die bump and solder balls)

GUN = 561-pin plastic BGA (leaded [Pb] solder balls)

ZUN = 561-pin plastic BGA (lead-free solder balls and leaded [Pb] die bumps)

DEVICE

DEVICE SPEED RANGE

Blank = 1 GHz

2 = 1.2 GHz

8 = 850 MHz

(

)

TEMPERATURE RANGE

Blank = 0 C to 100 C (default commercial temperature; 850-MHz and 1-GHz device)

Blank = 0°C to 95°C (default commercial temperature; 1.2-GHz device)

A = -40°C to 100°C (extended temperature; 1-GHz device)

A =

(extended temperature; 1.2-GHz device)

-40°C to 95°C

(

)

(

)

SILICON REVISION

(A)

F = Silicon Revision 2.1

TMS320C6474

SPRS552H

– OCTOBER 2008 – REVISED APRIL 2011

www.ti.com

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the

package type (for example, ZUN), the temperature range (for example, Blank is the default commercial

temperature range), and the device speed range in megahertz (for example, Blank is 1000 [1 GHz]).

Figure 2-11 provides a legend for reading the complete device name for any TMS320C64x+ DSP

generation member. For device part numbers and further ordering information for TMS320C6474 in the

CUN, GUN, or ZUN package type, see the TI website (www.ti.com) or contact your TI sales

representative.

Silicon revision correlates to the lot trace code found on the second line of the package marking. For more

information, see the TMS320C6474 Digital Signal Processor Silicon Errata (literature number SPRZ283).

BGA = Ball Grid Array

Figure 2-11. TMS320C64x+

™ DSP Device Nomenclature (including TMS320C6474 DSP)

2.9

Documentation Support

The following documents describe the TMS320C6474 multicore digital signal processor. Copies of these

documents are available on the Internet at www.ti.com. Tip: Enter the literature number in the search box

provided at www.ti.com.

SPRU732

TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide. Describes the CPU

architecture, pipeline, instruction set, and interrupts for the TMS320C64x and TMS320C64x+

digital signal processors (DSPs) of the TMS320C6000 DSP family. The C64x/C64x+ DSP

generation comprises fixed-point devices in the C6000 DSP platform. The C64x+ DSP is an

enhancement of the C64x DSP with added functionality and an expanded instruction set.

SPRU871

TMS320C64x+ DSP Megamodule Reference Guide. Describes the TMS320C64x+ digital

signal processor (DSP) megamodule. Included is a discussion on the internal direct memory

access (IDMA) controller, the interrupt controller, the power-down controller, memory

protection, bandwidth management, and the memory and cache.

SPRAA84

TMS320C64x to TMS320C64x+ CPU Migration Guide. Describes migrating from the Texas

Instruments TMS320C64x digital signal processor (DSP) to the TMS320C64x+ DSP. The

objective of this document is to indicate differences between the two cores. Functionality in

the devices that is identical is not included.

SPRU889

High-Speed DSP Systems Design Reference Guide. Provides recommendations for

meeting the many challenges of high-speed DSP system design. These recommendations

include information about DSP audio, video, and communications systems for the C5000 and

C6000 DSP platforms.

SPRUG08

TMS320C6474 DSP Ethernet Media Access Controller (EMAC)/ Management Data

Input/Output (MDIO) User's Guide. This document provides a functional description of the

Ethernet Media Access Controller (EMAC) and Physical layer (PHY) device Management

Data Input/Output (MDIO) module integrated with the TMS320C6474 digital signal

Device Overview

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Product Folder Link(s) :TMS320C6474

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