OPA548F datasheet(9/24 Pages) TI

9 / 24 page

OPA548

SBOS070B

www.ti.com

DDPAK-7(1)

(Package Designator KTW)

TO220-7

(Package Designator KVT)

NOTE: (1) For improved thermal performance increase footprint area.

See Figure 6, “Thermal Resistance vs Circuit Board Copper Area”.

Mean dimensions in inches. Refer to end of data sheet

or www.ti.com for tolerances and detailed package

drawings.

0.05

0.51

0.105

0.05

0.035

0.04

heat dissipation. See Figure 6 for typical thermal resistance

from junction-to-ambient as a function of the copper area.

POWER DISSIPATION

Power dissipation depends on power supply, signal, and load

conditions. For dc signals, power dissipation is equal to

the product of output current times the voltage across the

mounting surface with a mica (or other film) insulator (see

Figure 5). For lowest overall thermal resistance it is best to

isolate the entire heat sink/OPA548 structure from the mount-

ing surface rather than to use an insulator between the

semiconductor and heat sink.

For best thermal performance, the tab of the DDPAK sur-

face-mount version should be soldered directly to a circuit

board copper area. Increasing the copper area improves

13750

Ω

0.01

µF

(optional, for noisy

environments)

4.75V

CL =

– 13750

Ω

OPA547 CURRENT LIMIT: 0 to 5A

NOTE: (1) Resistors are nearest standard 1% values.

DESIRED

CURRENT LIMIT

2.5A

RESISTOR(1)

CL)

LIM Open

57.6k

Ω

14.7k

Ω

10k

Ω

4.02k

Ω

LIM Connected to V–

CURRENT

SET)

µA

167

µA

200

µA

267

µA

333

µA

VOLTAGE

SET)

(V–) + 4.75V

(V–) + 3.8V

(V–) + 2.5V

(V–) + 2V

(V–) + 1.1V

(V–)

RESISTOR METHOD

15000 (4.75V)

LIM

V–

13750

Ω

SET = ILIM /15000

SET = (V–) + 4.75V – (13750Ω) (ILIM)/15000

DAC METHOD (Current or Voltage)

V–

D/A

SET

4.75V

±I

LIM =

Max I

O = ILIM

(4.75) (15000)

13750

Ω + R

Max I

O = ILIM

±I

LIM =15000 ISET

FIGURE 3. Adjustable Current Limit.

FIGURE 4. TO-220 and DDPAK Solder Footprints.

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