TPS2592Ax

TPS2592Bx

SLVSC11A – JUNE 2013 – REVISED JUNE 2013

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PART NUMBER

PART MARKING

PACKAGE

TPS2592ALDRC

2592AL

10-pin DRC

TPS2592AADRC

2592AA

10-pin DRC

TPS2592BLDRC

2592BL

10-pin DRC

TPS2592BADRC

2592BA

10-pin DRC

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

UNIT

MIN

MAX

VIN

–0.3

20

V

VIN (10ms Transient)

22

Output voltage

OUT

–0.3

VIN + 0.3

V

ILIM

–0.3

7

V

EN/UVLO

–0.3

7

V

dV/dT

–0.3

7

V

BFET

–0.3

30

V

±2000

V

Electrostatic discharge

±500

V

Continuous power dissipation

See Thermal Characteristics

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions

is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to network ground terminal.

(3)

Tested in accordance with JEDEC Standard 22, Test Method A114-B

(4)

Tested in accordance with JEDEC Standard 22, Test Method C101-A

(5)

Tested in accordance with JEDEC Standard 22, Test Method A115-A

THERMAL CHARACTERISTICS

(1)

TPS2592xx

THERMAL METRIC

UNIT

DRC (10) PINS

Junction-to-ambient thermal resistance

45.9

Junction-to-case (top) thermal resistance

53

Junction-to-board thermal resistance

21.2

°C/W

Junction-to-top characterization parameter

1.2

Junction-to-board characterization parameter

21.4

Junction-to-case (bottom) thermal resistance

5.9

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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