LP8543 datasheet(5/40 Pages) TI

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LP8543

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SNVS604D – AUGUST 2009 – REVISED MARCH 2013

Absolute Maximum Ratings

(1) (2) (3)

VIN

-0.3V to +24.0V

VDDIO, VLDO

-0.3V to +6.0V

Voltage on Logic Pins (PWM, ADR EN, IF_SEL, ALSO, ALSI)

-0.3V to +6.0V

Voltage on Logic Pins (SCLK, SDA, FAULT)

-0.3V to VDDIO

V (OUT1...OUT7 SW, FB)

-0.3V to +44.0V

Continuous Power Dissipation (4)

Internally Limited

Junction Temperature (TJ-MAX)

125°C

Storage Temperature Range

-65°C to +150°C

Maximum Lead Temperature (Soldering)

(5)

ESD Rating

(6)

Human Body Model:

2 kV

Machine Model:

OUT7: 150V

All other pins : 200V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

All voltages are with respect to the potential at the GND pins.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and

disengages at TJ = 130°C (typ.).

(5)

For detailed soldering specifications and information, please refer to Texas Instruments AN1187: Leadless Leadframe Package (LLP).

(6)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. The machine model is a 200 pF

capacitor discharged directly into each pin. MIL-STD-883 3015.7

Operating Ratings

(1) (2)

Input Voltage Range VIN

5.5 to 22.0V

VDDIO

1.65 to 5V

V (OUT1...OUT7, SW, FB)

0 to 40V

Junction Temperature (TJ) Range

−40°C to +125°C

Ambient Temperature (TA) Range

(3)

−40°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

Thermal Properties

Junction-to-Ambient Thermal Resistance (

θJA), RTW Package

(1)

35 - 50°C/W

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

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