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ADXL375 Datasheet(PDF) 26 Page - Analog Devices |
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ADXL375 Datasheet(HTML) 26 Page - Analog Devices |
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26 / 32 page ![]() ADXL375 Data Sheet Rev. 0 | Page 26 of 32 APPLICATIONS INFORMATION POWER SUPPLY DECOUPLING A 1 µF tantalum capacitor (CS) at VS and a 0.1 µF ceramic capac- itor (CI/O) at VDD I/O placed close to the ADXL375 supply pins are recommended to adequately decouple the accelerometer from noise on the power supply. If additional decoupling is necessary, a resistor or ferrite bead (no larger than 100 Ω) in series with VS may be helpful. Additionally, increasing the bypass capacitance on VS to a 10 µF tantalum capacitor in parallel with a 0.1 µF ceramic capacitor may also improve noise performance. Make sure that the connection from the ADXL375 ground to the power supply ground has low impedance because noise trans- mitted through ground has an effect similar to noise transmitted through VS. It is recommended that VS and VDD I/O be separate supplies to minimize digital clocking noise on the VS supply. If it is not possible to use separate supplies, additional filtering of the supplies, as previously mentioned, may be necessary. ADXL375 GND INT1 INT2 CS SCL/SCLK SDO/ALT ADDRESS SDA/SDI/SDIO 3- OR 4-WIRE SPI OR I2C INTERFACE VS VS CS VDD I/O VDD I/O CI/O INTERRUPT CONTROL Figure 31. Application Diagram MECHANICAL CONSIDERATIONS FOR MOUNTING Mount the ADXL375 on the PCB in a location close to a hard mounting point of the PCB to the case. Mounting the ADXL375 at an unsupported PCB location, as shown in Figure 32, may result in large, apparent measurement errors due to undampened PCB vibration. Locating the accelerometer near a hard mounting point ensures that any PCB vibration at the accelerometer is above the mechanical sensor resonant frequency of the accelerometer and is, therefore, effectively invisible to the accelerometer. Multiple mounting points, close to the sensor, and/or a thicker PCB also help to reduce the effects of system resonance on the performance of the sensor. MOUNTING POINTS PCB ACCELEROMETERS Figure 32. Incorrectly Placed Accelerometers SHOCK DETECTION The shock interrupt function can detect mechanical shock events based on amplitude and pulse width. Figure 33 illustrates the following parameters for a valid single shock event and a valid double shock event. • Shock detection threshold—defined by the THRESH_ SHOCK register (Address 0x1D). • Maximum shock duration time (time limit for shocks)— defined by the DUR register (Address 0x21). • Shock latency time—defined by the latent register (Address 0x22). The latency time is the waiting period from the end of the first shock until the start of the time window, when a second shock can be detected. • Time window for second shock—defined by the window register (Address 0x23). The time window is the interval after the latency time (set by the latent register). Although a second shock must begin after the latency time expires, it need not finish before the end of the time defined by the window register. FIRST SHOCK TIME LIMIT FOR SHOCKS (DUR) LATENCY TIME (LATENT) TIME WINDOW FOR SECOND SHOCK (WINDOW) SECOND SHOCK SINGLE SHOCK INTERRUPT DOUBLE SHOCK INTERRUPT THRESHOLD (THRESH_SHOCK) Figure 33. Shock Interrupt Function with Valid Single and Double Shocks If only the single shock function is in use, the single shock interrupt is triggered when the acceleration goes below the threshold, as long as the duration time is not exceeded. If both the single and double shock functions are in use, the single shock interrupt is triggered when the double shock event is either validated or invalidated. |
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